B81C 2201/0176
Chemical vapour deposition
Official title: Chemical vapour Deposition
B81C2201/0176 (Chemical vapour deposition) appears on 181 US grants and 259 published applications in this corpus.
Search patents in B81C- Granted patents
- 181
- Published applications
- 259
- Assignees
- 132
- Inventors
- 553
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 2 |
| 2002 | 3 | 8 |
| 2003 | 5 | 7 |
| 2004 | 7 | 11 |
| 2005 | 7 | 2 |
| 2006 | 3 | 5 |
| 2007 | 4 | 3 |
| 2008 | 4 | 3 |
| 2009 | 1 | 1 |
| 2010 | 4 | 4 |
| 2011 | 5 | 4 |
| 2012 | 0 | 5 |
| 2013 | 3 | 8 |
| 2014 | 5 | 2 |
| 2015 | 3 | 2 |
| 2016 | 4 | 19 |
| 2017 | 12 | 17 |
| 2018 | 16 | 12 |
| 2019 | 8 | 9 |
| 2020 | 12 | 19 |
| 2021 | 7 | 13 |
| 2022 | 9 | 8 |
| 2023 | 11 | 25 |
| 2024 | 14 | 22 |
| 2025 | 9 | 26 |
| 2026 | 15 | 22 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- MEMS structure including a buried cavity with antistiction protuberances, and manufacturing methods thereof6 Oct 2026US 12,753,067 B2STMicroelectronics S,r.l.
- Anchor structure8 Sep 2026US 12,729,107 B2Lawrence Semiconductor Research Laboratory, Inc.
- MEMS sensor with a thin region1 Sep 2026US 12,726,773 B2Skyworks Solutions, Inc.
- Method for structural layer fabrication in micromechanical devices14 Jul 2026US 12,679,723 B2Murata Manufacturing Co., Ltd.
- Micro-electro-mechanical systems (MEMS) having vertical stops and anchor structures16 Jun 2026US 12,655,016 B2Lawrence Semiconductor Research Laboratory, Inc.
- Anchor structure1 Oct 2026US 2026/0296876 A1Lawrence Semiconductor Research Laboratory, Inc.
- Foundry-compatible process for integrated micro-speaker and microphone17 Sep 2026US 2026/0281642 A1Vibrant Microsystems Inc.
- Method for producing a microstructural element and microstructural element10 Sep 2026US 2026/0265049 A1Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Method for producing a silicon layer system with electrical connections27 Aug 2026US 2026/0250122 A1
- Manufacturing process of a microelectromechanical system with multiple cavities at different pressures and related microelectromechanical system20 Aug 2026US 2026/0242215 A1STMicroelectronics International N. V.
Most cited
By later US patents
- Method for forming micro cavity560US 6,342,427 B12002
- Method of fabricating microelectromechanical systems and devices having trench isolated contacts114US 6,936,491 B2Robert Bosch GmbH · 2005
- Deposited thin film void-column network materials89US 6,399,177 B1The Penn State Research Foundation · 2002
- Process for the production of accelerometers using silicon on insulator technology78US 5,576,250 ACommissariat A L' Energie Atomique · 1996
- Integrated method for release and passivation of MEMS structures73US 6,902,947 B2APPLIED Materials.Inc. · 2005