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US 6,399,177 B1Granted
Deposited thin film void-column network materials
AssigneeThe Penn State Research Foundation
InventorsStephen J. Fonash, Ali Kaan Kalkan, Sanghoon Bae
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AssigneeThe Penn State Research Foundation
InventorsStephen J. Fonash, Ali Kaan Kalkan, Sanghoon Bae
Estimating the term…
A novel porous film is disclosed comprising a network of silicon columns in a continuous void which may be fabricated using high density plasma deposition at low temperatures, i.e., less than about 250° C. This silicon film is a two-dimensional nano-sized array of rodlike columns. This void-column morphology can be controlled with deposition conditions and the porosity can be varied up to 90%. The simultaneous use of low temperature deposition and etching in the plasma approach utilized, allows for the unique opportunity of obtaining columnar structure, a continuous void, and polycrystalline column composition at the same time. Unique devices may be fabricated using this porous continuous film by plasma deposition of this film on a glass, metal foil, insulator or plastic substrates.
A nano-scale composition comprising:
A composite structure which comprises:
A sensor which comprises a composite structure having:
A gas detector which comprises a composite structure having:
An analytical device which comprises a composite structure having:
Dependencies are inferred from the claim text.