B81C 2201/019
Bonding or gluing multiple substrate layers
B81C2201/019 (Bonding or gluing multiple substrate layers) appears on 483 US grants and 598 published applications in this corpus.
Search patents in B81C- Granted patents
- 483
- Published applications
- 598
- Assignees
- 264
- Inventors
- 1,052
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 6 | 0 |
| 2001 | 7 | 7 |
| 2002 | 18 | 37 |
| 2003 | 19 | 32 |
| 2004 | 34 | 44 |
| 2005 | 22 | 28 |
| 2006 | 23 | 26 |
| 2007 | 23 | 25 |
| 2008 | 19 | 39 |
| 2009 | 12 | 38 |
| 2010 | 21 | 20 |
| 2011 | 18 | 28 |
| 2012 | 29 | 25 |
| 2013 | 10 | 27 |
| 2014 | 28 | 22 |
| 2015 | 28 | 18 |
| 2016 | 19 | 19 |
| 2017 | 18 | 30 |
| 2018 | 17 | 14 |
| 2019 | 26 | 26 |
| 2020 | 14 | 17 |
| 2021 | 16 | 11 |
| 2022 | 13 | 8 |
| 2023 | 9 | 15 |
| 2024 | 9 | 17 |
| 2025 | 9 | 15 |
| 2026 | 4 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Micro-electro-mechanical systems and preparation method thereof25 Aug 2026US 12,715,762 B2Huawei Technologies Co., Ltd.
- Multi-level mems process18 Aug 2026US 12,709,540 B2InvenSense, Inc.
- Micro-electro-mechanical system (MEMS) device and fabrication method thereof19 May 2026US 12,630,416 B2Vanguard International Semiconductor Corporation
- Packaging method and associated packaging structure27 Jan 2026US 12,534,361 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Multilayer fluidic devices and methods for their fabrication30 Dec 2025US 12,508,587 B2Illumina, Inc.
- Mems with curved mirrors and methods of manufacture17 Sep 2026US 2026/0276946 A1Calient.Ai Inc.
- Micro-electro-mechanical system package20 Aug 2026US 2026/0242212 A1Vanguard International Semiconductor Corporation
- Manufacturing process of a microelectromechanical system with multiple cavities at different pressures and related microelectromechanical system20 Aug 2026US 2026/0242215 A1STMicroelectronics International N. V.
- Silicon-metal composite micro-electro-mechanical system-based material atmospheric corrosion sensor, preparation method therefor, and material atmospheric corrosion detection equipment25 Jun 2026US 2026/0176132 A1University of Science and Technology Beijing
- Method for manufacturing an electronic device11 Jun 2026US 2026/0159381 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
Most cited
By later US patents
- Microfluidic structure and process for its manufacture704US 5,376,252 APharmacia Biosensor AB · 1994
- Microfabricated elastomeric valve and pump systems619US 6,408,878 B1California Institute of Technology · 2002
- Multi-layer microfluidic devices394US 6,167,910 ACaliper Technologies Corp. · 2001
- Fabrication of microfluidic circuits by printing techniques383US 6,074,725 ACaliper Technologies Corp. · 2000
- Method of fabricating vertical integrated circuits333US 6,875,671 B2Reveo, Inc. · 2005