Micro-electro-mechanical systems and preparation method thereof

A two-dimensional micro-electro-mechanical systems (MEMS) apparatus, comprising:

• a first MEMS apparatus;
• and
• a second MEMS apparatus,
• wherein a movable platform of the first MEMS apparatus is used as a substrate for fastening the second MEMS apparatus,
• wherein a support beam of the first MEMS apparatus and a support beam of the second MEMS apparatus are perpendicular to each other,
• wherein each of the first MEMS apparatus and the second MEMS apparatus comprises first fixed comb fingers, second fixed comb fingers, a support beam, a movable platform, and movable comb fingers,
• wherein the first fixed comb fingers and the second fixed comb fingers are fastened to a substrate,
• wherein two ends of the support beam are fastened to the substrate, and the movable platform is coupled to the support beam,
• wherein the movable comb fingers are coupled to the movable platform, and form a three-layer comb finger structure with the first fixed comb fingers and the second fixed comb fingers,
• wherein the first fixed comb fingers are arranged in a first layer, the second fixed comb fingers are arranged in a second layer, and the movable comb fingers are arranged in third layer between the first and second layers, and
• wherein the first fixed comb fingers are electrically isolated from the second fixed comb fingers via a first insulation layer, the support beam is electrically isolated from the substrate via a second insulation layer, and the first insulation layer and second insulation layer are located on a same plane.

A micro-electro-mechanical systems (MEMS) apparatus array, comprising:

• a plurality of MEMS apparatuses,
• wherein the plurality of MEMS apparatuses are one-dimensionally distributed or two-dimensionally distributed,
• wherein each of the plurality of MEMS apparatuses comprises first fixed comb fingers, second fixed comb fingers, a support beam, a movable platform, and movable comb fingers,
• wherein the first fixed comb fingers and the second fixed comb fingers are fastened to a substrate,
• wherein two ends of the support beam are fastened to the substrate, and the movable platform is coupled to the support beam,
• wherein the movable comb fingers are coupled to the movable platform, and form a three-layer comb finger structure with the first fixed comb fingers and the second fixed comb fingers,
• wherein the first fixed comb fingers are arranged in a first layer, the second fixed comb fingers are arranged in a second layer, and the movable comb fingers are arranged in third layer between the first and second layers, and
• wherein the first fixed comb fingers are electrically isolated from the second fixed comb fingers via a first insulation layer, the support beam is electrically isolated from the substrate via a second insulation layer, and the first insulation layer and second insulation layer are located on a same plane.

A method for preparing a micro-electro-mechanical systems (MEMS) apparatus, comprising:

• forming first fixed comb fingers on a first wafer through photoetching;
• forming movable comb fingers, a movable platform, and a support beam on a double-layer second wafer through photoetching;
• bonding the first wafer to the double-layer second wafer to form a bonded wafer, after the double-layer second wafer has been photoetched with the movable comb fingers, the movable platform, and the support beam;
• forming second fixed comb fingers on the bonded wafer through photoetching;
• and
• releasing the movable platform and the movable comb fingers.