B81C 2201/0197
Processes for making multi-layered devices not provided for in groups b81c2201/0176 -
Official title: Processes for making multi-layered devices not provided for in groups B81C2201/0176 - B81C2201/0192
B81C2201/0197 (Processes for making multi-layered devices not provided for in groups b81c2201/0176 -) appears on 77 US grants and 123 published applications in this corpus.
Search patents in B81C- Granted patents
- 77
- Published applications
- 123
- Assignees
- 65
- Inventors
- 218
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 4 |
| 2002 | 3 | 1 |
| 2003 | 2 | 3 |
| 2004 | 1 | 3 |
| 2005 | 0 | 5 |
| 2006 | 0 | 8 |
| 2007 | 8 | 8 |
| 2008 | 2 | 8 |
| 2009 | 3 | 3 |
| 2010 | 5 | 12 |
| 2011 | 3 | 2 |
| 2012 | 0 | 5 |
| 2013 | 5 | 4 |
| 2014 | 2 | 9 |
| 2015 | 1 | 9 |
| 2016 | 6 | 8 |
| 2017 | 9 | 6 |
| 2018 | 3 | 4 |
| 2019 | 4 | 0 |
| 2020 | 3 | 5 |
| 2021 | 1 | 3 |
| 2022 | 2 | 0 |
| 2023 | 4 | 1 |
| 2024 | 3 | 4 |
| 2025 | 2 | 2 |
| 2026 | 2 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Inertial sensor and method for forming the same19 May 2026US 12,631,453 B2AAC Technologies PTE.Ltd.
- Micro-electro-mechanical system (MEMs) devices including sidewall stoppers27 Jan 2026US 12,534,362 B2Vanguard International Semiconductor Corporation
- Low-cost microfluidic devices and systems and method of manufacturing25 Nov 2025US 12,478,962 B1Corporation for National Research Initiatives
- Semiconductor structure and method of manufacturing the same21 Oct 2025US 12,448,279 B2Taiwan Semiconductor Manufacturing Company.Ltd
- On-chip integrated silicon carbide pressure and temperature sensors23 Jul 2024US 12,044,585 B1United States Government Administrator of NASA
- Method for manufacturing a microelectromechanical component, and microelectromechanical component1 Oct 2026US 2026/0296882 A1
- Volumetric formation of structures11 Jun 2026US 2026/0158255 A1University of Central Florida Research Foundation, Inc.
- Dielectric stack for microelectromechanical system devices and methods of fabrication thereof30 Apr 2026US 2026/0116740 A1Texas Instruments Incorporated
- Method of fabricating micro-electro-mechanical system (mems) device30 Apr 2026US 2026/0116744 A1Vanguard International Semiconductor Corporation
- Mems device29 Jan 2026US 2026/0028222 A1Rohm Co., Ltd.
Most cited
By later US patents
- Method for electrochemical fabrication261US 6,027,630 AUniversity of Southern California · 2000
- Method of making a semiconductor transducer having multiple level diaphragm structure83US 4,665,610 AStanford University · 1987
- Method for electrochemical fabrication64US 6,790,377 B1University of Southern California · 2004
- Method for electrochemical fabrication59US 6,475,369 B1University of Southern California · 2002
- Apparatus for electrochemical fabrication using a conformable mask49US 6,572,742 B1University of Southern California · 2003