Low-cost microfluidic devices and systems and method of manufacturing

A microfluidic device comprising:

• a plurality of low temperature co-fired ceramic (LTCC) layers aligned, stacked and bonded together forming groups of layers, wherein multiple groups of the plurality of LTCC layers are transitioned into a co-fired ceramic material and are aligned and bonded together to form the microfluidic device;
• and
• one or more semiconductor devices bonded to pre-determined surfaces of one or more LTCC layers of the plurality of LTCC layers, wherein:
• one or more LTCC layers of the plurality of LTCC layers include one or more openings of pre-determined sizes, shapes, and spatial locations for the containment of fluids;
• one or more LTCC layers of the plurality of LTCC layers include one or more openings of pre-determined sizes, shapes, and spatial locations for the placement of the one or more semiconductor devices;
• one or more LTCC layers of the plurality of LTCC layers include one or more openings of pre-determined sizes, shapes and spatial locations filled with an electrically conductive material to form electrical interconnection pathways through multiple LTCC layers of the plurality of LTCC layers;
• one or more LTCC layers of the plurality of LTCC layers include pre-determined patterns of electrical connections fabricated with an electrically conductive material on the surfaces of the LTCC layers and/or in the LTCC layers to form electrical interconnection pathways across LTCC layers;
• one or more LTCC layers of the plurality of LTCC layers include one or more openings of pre-determined sizes, shapes, and locations fabricated through the thickness of the LTCC layers to form fluidic inlet and outlet ports;
• one or more LTCC layers of the plurality of LTCC layers include one or more bonding material layers patterned with pre-determined sizes, shapes and locations on the surfaces for bonding of the one or more semiconductor devices onto one or more of the layers;
• and
• one or more LTCC layers of the plurality of LTCC layers include one or more bonding material layers patterned with pre-determined sizes, shapes and locations on the surfaces of the layers with the bonding of the groups of LTCC layers to one another.