B81C 1/00523
Etching material
Official title: {Etching material}
B81C1/00523 (Etching material) appears on 433 US grants and 522 published applications in this corpus.
Search patents in B81C- Granted patents
- 433
- Published applications
- 522
- Assignees
- 266
- Inventors
- 1,065
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 1 |
| 2002 | 2 | 7 |
| 2003 | 2 | 8 |
| 2004 | 5 | 6 |
| 2005 | 5 | 15 |
| 2006 | 8 | 17 |
| 2007 | 8 | 12 |
| 2008 | 9 | 9 |
| 2009 | 6 | 9 |
| 2010 | 6 | 14 |
| 2011 | 8 | 14 |
| 2012 | 8 | 8 |
| 2013 | 12 | 20 |
| 2014 | 23 | 55 |
| 2015 | 39 | 52 |
| 2016 | 39 | 51 |
| 2017 | 34 | 26 |
| 2018 | 38 | 31 |
| 2019 | 26 | 28 |
| 2020 | 36 | 36 |
| 2021 | 36 | 34 |
| 2022 | 21 | 18 |
| 2023 | 23 | 11 |
| 2024 | 17 | 16 |
| 2025 | 9 | 17 |
| 2026 | 4 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Systems and methods for fabricating a 2D-material-based quantum sensor chip14 Jul 2026US 12,685,199 B2Toyota Jidosha Kabushiki Kaisha
- Method and device for locally removing and/or modifying a polymer material on a surface28 Apr 2026US 12,612,305 B2Robert Bosch GmbH
- Method for wafer treatment27 Jan 2026US 12,538,764 B2Hua Hsu Advanced Technology Co., Ltd.
- Methods of fabricating porous silicon structures6 Jan 2026US 12,516,438 B2The Methodist Hospital
- Etching method11 Nov 2025US 12,469,711 B2Ulvac, Inc.
- Mems with curved mirrors and methods of manufacture17 Sep 2026US 2026/0276946 A1Calient.Ai Inc.
- Method for producing a silicon layer system with electrical connections27 Aug 2026US 2026/0250122 A1
- Method and apparatus for providing membrane pattern built-in differential piezoresistive pressure sensors30 Jul 2026US 2026/0219120 A1Posifa Technologies Inc.
- Bumpstop process for a motion sensor21 May 2026US 2026/0138865 A1InvenSense, Inc.
- Method for singulating a wafer and suitable device21 May 2026US 2026/0138869 A1Carl Zeiss SMT GmbH
Most cited
By later US patents
- Method and apparatus for etching100US 8,298,959 B2APPLIED Materials.Inc. · 2012
- Process for manufacturing electro-mechanical systems94US 9,139,425 B2SPTS Technologies Limited · 2015
- Micro-electro-mechanical transducer having a surface plate85US 7,880,565 B2Kolo Technologies, Inc. · 2011
- Analyte sensor and fabrication methods85US 8,696,917 B2Edwards Lifesciences Corporation · 2014
- Micro-electro-mechanical transducer having a surface plate82US 8,018,301 B2Kolo Technologies, Inc. · 2011