Method for singulating a wafer and suitable device

Abstract

A method for singulating a wafer having a first surface and a second surface situated opposite the first surface is disclosed. The method includes the following steps: contacting the wafer with a protective device having one or a plurality of carrying structures such that the first surface of the wafer is in contact with the plurality of carrying structures, singulating the wafer that is in contact with the protective device into a plurality of chips, and removing the chips from the wafer that is in contact with the protective device. Furthermore, a protective device having one or a plurality of carrying structures for temporarily carrying a wafer is disclosed. The protective device is configured to be used in the method disclosed herein.

Dependencies are inferred from the claim text.