B81C 1/00436
Shaping materials, i.e. techniques for structuring the substrate or the layers on
Official title: {Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate}
B81C1/00436 (Shaping materials, i.e. techniques for structuring the substrate or the layers on) appears on 1,498 US grants and 1,736 published applications in this corpus.
Search patents in B81C- Granted patents
- 1,498
- Published applications
- 1,736
- Assignees
- 627
- Inventors
- 3,239
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 6 | 0 |
| 1997 | 5 | 0 |
| 1998 | 10 | 0 |
| 1999 | 11 | 0 |
| 2000 | 13 | 0 |
| 2001 | 20 | 9 |
| 2002 | 18 | 33 |
| 2003 | 30 | 46 |
| 2004 | 39 | 78 |
| 2005 | 54 | 85 |
| 2006 | 48 | 91 |
| 2007 | 52 | 66 |
| 2008 | 47 | 67 |
| 2009 | 42 | 53 |
| 2010 | 51 | 63 |
| 2011 | 48 | 73 |
| 2012 | 46 | 56 |
| 2013 | 55 | 80 |
| 2014 | 91 | 105 |
| 2015 | 88 | 111 |
| 2016 | 100 | 108 |
| 2017 | 75 | 80 |
| 2018 | 90 | 89 |
| 2019 | 73 | 74 |
| 2020 | 89 | 86 |
| 2021 | 85 | 82 |
| 2022 | 58 | 48 |
| 2023 | 48 | 40 |
| 2024 | 43 | 43 |
| 2025 | 33 | 41 |
| 2026 | 21 | 29 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- B81C 1/00555Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity690
- B81C 1/00444Surface micromachining, i.e. structuring layers on the substrate482
- B81C 1/00523Etching material433
- B81C 1/00634Processes for shaping materials not provided for in groups b81c1/00444 - b81c1/0062651
- B81C 1/005Bulk micromachining43
Recent patents
- Engineered substrates, free-standing semiconductor microstructures, and related systems and methods6 Oct 2026US 12,753,068 B2Lawrence Semiconductor Research Laboratory, Inc.
- Three dimensional stacked microstructures for use in gyroscopes and other devices1 Sep 2026US 12,723,874 B2The Regents of the University of Michigan
- Systems and methods for fabricating a 2D-material-based quantum sensor chip14 Jul 2026US 12,685,199 B2Toyota Jidosha Kabushiki Kaisha
- Method for producing a microelectromechanical component16 Jun 2026US 12,655,018 B2Robert Bosch GmbH
- Method of producing an etching mask, method of etching a structure into a substrate, use of a tetrel layer and structure for producing a mask26 May 2026US 12,642,059 B2JENOPTIK Optical Systems GmbH
- Method for producing a microelectromechanical device comprising a cap structure and a microelectromechanical device8 Oct 2026US 2026/0307983 A1
- Mems with curved mirrors and methods of manufacture17 Sep 2026US 2026/0276946 A1Calient.Ai Inc.
- Method for producing a silicon layer system with electrical connections27 Aug 2026US 2026/0250122 A1
- Method for producing a mems converter using a stretching of an actuator material27 Aug 2026US 2026/0255880 A1Hahn-Schickard-Gesellschaft FüR Angewandte Forschung E. V.
- Method of manufacturing a microstructure6 Aug 2026US 2026/0225877 A1
Most cited
By later US patents
- Method of anisotropically etching silicon679US 5,501,893 ARobert Bosch GmbH · 1996
- Release strategies for making transferable semiconductor structures, devices and device components321US 7,932,123 B2The Board of Trustees of the University of Illinois · 2011
- Planarized sacrificial layer for MEMS fabrication281US 8,278,802 B1RF Micro Devices, Inc. · 2012
- Microneedle structure and production method therefor231US 6,533,949 B1Nanopass Ltd. · 2003
- Release strategies for making transferable semiconductor structures, devices and device components208US 8,895,406 B2The Board of Trustees of the University of Illinois · 2014