B81C 1/00555
Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
Official title: {Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity (B81C1/00023 - B81C1/0019 take precedence)}
B81C1/00555 (Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity) appears on 690 US grants and 720 published applications in this corpus.
Search patents in B81C- Granted patents
- 690
- Published applications
- 720
- Assignees
- 323
- Inventors
- 1,426
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 5 | 0 |
| 1997 | 5 | 0 |
| 1998 | 10 | 0 |
| 1999 | 9 | 0 |
| 2000 | 8 | 0 |
| 2001 | 14 | 7 |
| 2002 | 9 | 22 |
| 2003 | 18 | 22 |
| 2004 | 28 | 34 |
| 2005 | 28 | 36 |
| 2006 | 27 | 40 |
| 2007 | 25 | 26 |
| 2008 | 17 | 30 |
| 2009 | 20 | 16 |
| 2010 | 23 | 25 |
| 2011 | 22 | 34 |
| 2012 | 19 | 29 |
| 2013 | 20 | 33 |
| 2014 | 43 | 30 |
| 2015 | 34 | 43 |
| 2016 | 39 | 48 |
| 2017 | 41 | 37 |
| 2018 | 37 | 36 |
| 2019 | 36 | 32 |
| 2020 | 38 | 32 |
| 2021 | 32 | 28 |
| 2022 | 21 | 15 |
| 2023 | 16 | 19 |
| 2024 | 18 | 22 |
| 2025 | 15 | 14 |
| 2026 | 8 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- B81C 1/00626Processes for achieving a desired geometry not provided for in groups b81c1/00563203
- B81C 1/00619Forming high aspect ratio structures having deep steep walls183
- B81C 1/00563Avoid or control over-etching146
- B81C 1/00595Control etch selectivity130
- B81C 1/00611Processes for the planarisation of structures65
- B81C 1/00603Aligning features and geometries on both sides of a substrate25
Recent patents
- Engineered substrates, free-standing semiconductor microstructures, and related systems and methods6 Oct 2026US 12,753,068 B2Lawrence Semiconductor Research Laboratory, Inc.
- Method for producing a microelectromechanical component16 Jun 2026US 12,655,018 B2Robert Bosch GmbH
- Method of producing an etching mask, method of etching a structure into a substrate, use of a tetrel layer and structure for producing a mask26 May 2026US 12,642,059 B2JENOPTIK Optical Systems GmbH
- Method for machining a workpiece17 Mar 2026US 12,576,460 B2TRUMPF Laser- und Systemtechnik GmbH
- Method for producing at least one first and one second micromirror device10 Mar 2026US 12,570,522 B2Robert Bosch GmbH
- Method for producing a microelectromechanical device comprising a cap structure and a microelectromechanical device8 Oct 2026US 2026/0307983 A1
- Method for manufacturing microstructures6 Aug 2026US 2026/0231708 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Method for producing a micromechanical layer structure with high aspect ratio and micromechanical layer structure21 May 2026US 2026/0138867 A1
- Preventing electrode discontinuation on microdevice sidewall14 May 2026US 2026/0136906 A1VueReal Inc.
- Mems device with recessed combs30 Apr 2026US 2026/0116738 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Method of anisotropically etching silicon679US 5,501,893 ARobert Bosch GmbH · 1996
- Microelectromechanical accelerometer for automotive applications205US 6,199,874 B1Cornell Research Foundation, Inc. · 2001
- Chemical-mechanical polishing of recessed microelectromechanical devices181US 5,919,548 ASandia Corporation · 1999
- Continuous laminar fluid mixing in micro-electromechanical systems168US 6,520,197 B2The Regents of the University of California · 2003
- Accelerometer sensor of crystalline material and method for manufacturing the same160US 5,578,755 ARobert Bosch GmbH · 1996