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US 2026/0136906 A1Published application
Preventing electrode discontinuation on microdevice sidewall
AssigneeVueReal Inc.
InventorsGholamreza CHAJI, Ehsanollah FATHI
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Abstract
This disclosure relates to the process of etching and treatment of side walls while processing microdevices. One aspect is to fill the device wall indentation with a polymer. The disclosure relates to a method and device with its structure to the process of etching and treatment of sidewalls. The methods of etching, coating, and curing are used.
Claims1
A method to planarize sidewalls of microdevices, the method comprising:
- removing a polymer coated on a microdevice by an etching process and leaving the polymer in a sidewall indentation.
Dependencies are inferred from the claim text.