B81C 1/00603
Aligning features and geometries on both sides of a substrate
Official title: {Aligning features and geometries on both sides of a substrate, e.g. when double side etching}
B81C1/00603 (Aligning features and geometries on both sides of a substrate) appears on 25 US grants and 30 published applications in this corpus.
Search patents in B81C- Granted patents
- 25
- Published applications
- 30
- Assignees
- 19
- Inventors
- 57
- Latest grant
- 12 Mar 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2006 | 0 | 1 |
| 2007 | 1 | 3 |
| 2008 | 0 | 1 |
| 2009 | 3 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 2 | 1 |
| 2013 | 0 | 3 |
| 2014 | 2 | 2 |
| 2015 | 1 | 2 |
| 2016 | 2 | 4 |
| 2017 | 2 | 2 |
| 2018 | 2 | 2 |
| 2019 | 3 | 2 |
| 2020 | 4 | 2 |
| 2021 | 0 | 0 |
| 2022 | 1 | 0 |
| 2023 | 1 | 1 |
| 2024 | 1 | 2 |
| 2025 | 0 | 1 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Micro-electro-mechanical systems micromirrors and micromirror arrays12 Mar 2024US 11,927,741 B2Preciseley Microtechnology Corp.
- Micro-electro-mechanical systems micromirrors and micromirror arrays31 Jan 2023US 11,567,312 B2Preciseley Microtechnology Corp.
- Method for manufacturing an opening structure and opening structure11 Jan 2022US 11,223,904 B2Infineon Technologies AG
- Microfabricated gas flow structure6 Oct 2020US 10,794,374 B2The Regents of the University of Michigan
- Method of etching microelectronic mechanical system features in a silicon wafer22 Sep 2020US 10,784,115 B2The Board of Trustees of the Leland Stanford Junior University
- Mems device with recessed combs30 Apr 2026US 2026/0116738 A1Murata Manufacturing Co., Ltd.
- Membrane Device Fabrication1 May 2025US 2025/0136437 A1X-FAB Global Services GmbH
- Microfabricated Multiemitter Electrospray Thrusters28 Nov 2024US 2024/0392735 A1
- Micro-electro-mechanical systems micromirrors and micromirror arrays4 Apr 2024US 2024/0111148 A1Preciseley Microtechnology Corp.
- Micro-electro-mechanical systems micromirrors and micromirror arrays27 Apr 2023US 2023/0126293 A1Preciseley Microtechnology Corp.
Most cited
By later US patents
- Method and device for wafer backside alignment overlay accuracy16US 7,494,830 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2009
- Methods of forming microdevice substrates using double-sided alignment techniques6US 8,283,256 B1Integrated Device Technology, Inc. · 2012
- Method and system for wafer backside alignment4US 7,611,960 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2009
- Method of performing a double-sided process3US 7,306,955 B2Touch Micro-System Technology Inc. · 2007
- Method of etching microelectronic mechanical system features in a silicon wafer1US 10,395,940 B1The Board of Trustees of the Leland Stanford Junior University · 2019