Micro-electro-mechanical systems micromirrors and micromirror arrays

A micromirror array comprising:

• an array of micromirrors, each micromirror comprising:
• a mirror pivotally attached to a mount by a first pivoting structure that permits pivotal movement of the mirror relative to the mount about a first axis;
• a first comb drive having a first portion fixed relative to the mirror and a second portion fixed relative to the mount, and the first comb drive being adapted to actuate the mirror about the first axis;
• a first support structure pivotally attached to the mount by a second pivoting structure that permits pivotal movement of the mount relative to the first support structure about a second axis, and the second axis being non-parallel to the first axis;
• and
• a second comb drive having a first portion fixed relative to the mount and a second portion fixed relative to the first support structure, and the second comb drive being adapted to actuate the mount about the second axis;
• wherein:
• the first portion and the second portion of at least one of the first comb drive and the second comb drive are formed from a common wafer with the first support structure and are electrically isolated by an isolation trench that is formed in the common wafer, the isolation trench being defined by opposed faces that are separated by alternating sections of insulating material and air along the isolation trench;
• and
• for at least one of the first comb drive and the second comb drive, the first portion is offset from the second portion in a direction perpendicular to the first axis and the second axis;
• and
• a Through Silicon Via (TSV) wafer having electrical connections that extend between a first side and a second side of the TSV wafer, the array of micromirrors being mounted adjacent to the second side of the TSV wafer such that the first and second portions of each of the first and second comb drives are electrically connected to the electrical connections.

A micromirror comprising:

• a mirror pivotally attached to a mount by a first pivoting structure that permits pivotal movement of the mirror relative to the mount about a first axis;
• a first comb drive having a first portion fixed relative to the mirror and a second portion fixed relative to the mount, and the first comb drive being adapted to actuate the mirror about the first axis;
• a first support structure pivotally attached to the mount by a second pivoting structure that permits pivotal movement of the mount relative to the first support structure about a second axis, and the second axis being non-parallel to the first axis;
• a second comb drive having a first portion fixed relative to the mount and a second portion fixed relative to the first support structure, and the second comb drive being adapted to actuate the mount about the second axis;
• and
• a Through Silicon Via (TSV) wafer having electrical connections that extend between a first side and a second side of the TSV wafer, the electrical connections extending out from the second side of the TSV wafer and the micromirror being mounted to the electrical connections such that the first and second portions of each of the first and second comb drives are electrically connected to the electrical connections;
• wherein;
• the first comb drive, the first support structure, and the second comb drive are formed from a common wafer, and for each of the first comb drive and the second comb drive, the first portion is offset from the second portion in a direction perpendicular to the first axis and the second axis;
• and
• the first portion and the second portion of at least one of the first comb drive and the second comb drive are electrically isolated by an isolation trench that is formed in the common wafer, the isolation trench being defined by opposed faces that are separated by alternating sections of insulating material and air along the isolation trench.