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US 7,306,955 B2Granted
Method of performing a double-sided process
AssigneeTouch Micro-System Technology Inc.
InventorChen-Hsiung Yang
Life of this patent
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Abstract
A method of performing a double-sided process is provided. First, a wafer having a structural pattern disposed on the front surface is provided. Following that, a plurality of front scribe lines are defined on the structural pattern, and a filling layer is filled into the front scribe lines. Subsequently, the structural pattern is bonded to a carrier wafer with a bonding layer, and a plurality of back scribe lines are defined on the back surface of the wafer. Finally, the filling layer filled in the front scribe lines is removed.
Claims13
A method of performing a double-sided process, the method comprising:
- providing a wafer, a front surface of the wafer comprising a structural pattern;
- defining a plurality of front scribe lines on the structural pattern;
- filling a filling layer into the front scribe lines;
- providing a carrier wafer, and bonding the structural pattern to the carrier wafer with a bonding layer;
- defining a plurality of back scribe lines on a back surface of the wafer;
- removing the filling layer filled in the front scribe lines;
- attaching an extensible tape to the back surface of the wafer after the step of removing the filling layer in the front scribe lines;
- removing the bonding layer;
- and
- performing an automatic wafer expansion and die sorting process.
7 more elements
Dependencies are inferred from the claim text.