B81C 1/00563
Avoid or control over-etching
Official title: {Avoid or control over-etching}
B81C1/00563 (Avoid or control over-etching) appears on 146 US grants and 146 published applications in this corpus.
Search patents in B81C- Granted patents
- 146
- Published applications
- 146
- Assignees
- 84
- Inventors
- 295
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 2 |
| 2002 | 4 | 7 |
| 2003 | 4 | 3 |
| 2004 | 6 | 10 |
| 2005 | 7 | 5 |
| 2006 | 10 | 14 |
| 2007 | 6 | 3 |
| 2008 | 4 | 11 |
| 2009 | 4 | 2 |
| 2010 | 7 | 2 |
| 2011 | 3 | 7 |
| 2012 | 1 | 11 |
| 2013 | 9 | 3 |
| 2014 | 8 | 7 |
| 2015 | 4 | 6 |
| 2016 | 9 | 5 |
| 2017 | 5 | 9 |
| 2018 | 5 | 4 |
| 2019 | 9 | 10 |
| 2020 | 9 | 6 |
| 2021 | 5 | 5 |
| 2022 | 7 | 3 |
| 2023 | 2 | 4 |
| 2024 | 2 | 4 |
| 2025 | 3 | 2 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method of producing an etching mask, method of etching a structure into a substrate, use of a tetrel layer and structure for producing a mask26 May 2026US 12,642,059 B2JENOPTIK Optical Systems GmbH
- Micro-electro-mechanical system (MEMs) devices including sidewall stoppers27 Jan 2026US 12,534,362 B2Vanguard International Semiconductor Corporation
- Method for producing a bonding pad for a micromechanical sensor element2 Sep 2025US 12,404,170 B2Robert Bosch GmbH
- MEMS element and vibration-driven energy harvesting device26 Aug 2025US 12,398,032 B2Kabushiki Kaisha Saginomiya Seisakusho
- MEMS device built using the BEOL metal layers of a solid state semiconductor process28 Jan 2025US 12,209,009 B2Nanusens SL
- Method of fabricating micro-electro-mechanical system (mems) device30 Apr 2026US 2026/0116744 A1Vanguard International Semiconductor Corporation
- Mems device built using the beol metal layers of a solid state semiconductor process24 Jul 2025US 2025/0236506 A1Nanusens SL
- Micro system and manufacturing method6 Feb 2025US 2025/0042725 A1Audio Pixels Ltd.
- Double notch etch to reduce under cut of micro electro-mechanical system (mems) devices14 Nov 2024US 2024/0375942 A1Calient Technologies, Inc.
- Undercut-free patterned aluminum nitride structure and methods for forming the same7 Nov 2024US 2024/0368746 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method and apparatus for monitoring processes using multiple parameters of a semiconductor wafer processing system122US 5,910,011 AAPPLIED Materials.Inc. · 1999
- Method for fabricating microstructures with deep anisotropic etching of thick silicon wafers97US 6,787,052 B12004
- Micromechanical component including function components suspended movably above a substrate73US 6,686,638 B2Robert Bosch GmbH · 2004
- Method and devices for detecting the end point of plasma process70US 5,980,767 ATokyo Electron Limited · 1999
- Method of manufacture for microelectromechanical devices55US 7,476,327 B2Idc, LLC · 2009