Micromechanical component including function components suspended movably above a substrate

A micromechanical component including function components suspended movably above a substrate, comprising:

• a substrate;
• a first insulation layer provided above the substrate;
• a first micromechanical function layer including at least one conductor region and at least one sacrificial layer region provided above the first insulation layer;
• a second insulation layer provided above the conductor region and above the first insulation layer;
• a third insulation layer provided above the second insulation layer;
• a second micromechanical function layer provided above the third insulation layer, the second micromechanical function layer including the suspended function components, at least one first trench and at least one second trench, the first trench extending at least to the third insulation layer and the second trench extending at least to the third insulation layer above the conductor region;
• and
• a fourth insulation layer arranged above the second micromechanical function layer to one of protect and passivate side walls of the at least one first trench and the at least one second trench.