B81C 1/00579
Avoid charge built-up
Official title: {Avoid charge built-up}
B81C1/00579 (Avoid charge built-up) appears on 26 US grants and 27 published applications in this corpus.
Search patents in B81C- Granted patents
- 26
- Published applications
- 27
- Assignees
- 19
- Inventors
- 70
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 1 | 1 |
| 2003 | 1 | 3 |
| 2004 | 1 | 4 |
| 2005 | 3 | 3 |
| 2006 | 3 | 4 |
| 2007 | 2 | 0 |
| 2008 | 2 | 4 |
| 2009 | 2 | 1 |
| 2010 | 4 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 2 |
| 2013 | 0 | 0 |
| 2014 | 1 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 1 | 1 |
| 2018 | 1 | 0 |
| 2019 | 2 | 2 |
| 2020 | 0 | 0 |
| 2021 | 0 | 1 |
| 2022 | 1 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method of producing an etching mask, method of etching a structure into a substrate, use of a tetrel layer and structure for producing a mask26 May 2026US 12,642,059 B2JENOPTIK Optical Systems GmbH
- Semiconductor device and method of manufacturing thereof14 Jun 2022US 11,358,858 B2Panasonic Intellectual Property Management Co., Ltd.
- Method of production of semiconductor device having semiconductor layer and support substrate spaced apart by recess19 Nov 2019US 10,479,675 B2Denso Corporation
- Wafer level packaging for MEMS device28 May 2019US 10,301,171 B1Globalfoundries Singapore Pte. Ltd.
- Semiconductor devices with moving members and methods for making the same2 Oct 2018US 10,087,069 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of producing an etching mask, method of etching a structure into a substrate, use of a tetrel layer and structure for producing a mask12 Sep 2024US 2024/0304446 A1JENOPTIK Optical Systems GmbH
- Semiconductor device and method of manufacturing thereof29 Jul 2021US 2021/0229978 A1Panasonic Intellectual Property Management Co., Ltd.
- Wafer level packaging for mems device16 May 2019US 2019/0144265 A1Globalfoundries Singapore Pte. Ltd.
- Semiconductor device production method24 Jan 2019US 2019/0023563 A1Denso Corporation
- Semiconductor Devices with Moving Members and Methods for Making the Same15 Jun 2017US 2017/0166435 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method of manufacture for microelectromechanical devices55US 7,476,327 B2Idc, LLC · 2009
- Method for fabrication MEMS-resonator45US 7,666,700 B2Oki Semiconductor Co., Ltd. · 2010
- Method of manufacture for microelectromechanical devices36US 7,704,772 B2QUALCOMM MEMS Technologies, Inc. · 2010
- Method for microfabricating structures using silicon-on-insulator material29US 7,335,527 B22008
- Deep reactive ion etching process and microelectromechanical devices formed thereby20US 6,500,348 B2Delphi Technologies, Inc. · 2002