Method of manufacture for microelectromechanical devices
AssigneeIdc, LLC
InventorsMing-Hau Tung, Brian James Gally, Manish Kothari, Clarence Chui, John Batey
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Abstract
A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.
Claims14
A method of manufacturing a microelectromechanical device, comprising:
- forming at least a first and a second conductive layer on a substrate;
- forming an isolation layer between the two conductive layers;
- electrically coupling the conductive layers together using a solid conductor to provide electrical connection to the conductive layers;
- removing the isolation layer to form a gap between the first conductive layer and the second conductive layer;
- and
- electrically decoupling the conductive layers after removing the isolation layer.
The method of claim I, wherein electrically coupling the conductive layers together comprises using conductive wires for each conductive layer and electrically connecting all of the wires to the same potential.
Dependencies are inferred from the claim text.