B81C 1/00587
Processes for avoiding or controlling over-etching not provided for in b81c1/00571 -
Official title: {Processes for avoiding or controlling over-etching not provided for in B81C1/00571 - B81C1/00579}
B81C1/00587 (Processes for avoiding or controlling over-etching not provided for in b81c1/00571 -) appears on 52 US grants and 48 published applications in this corpus.
Search patents in B81C- Granted patents
- 52
- Published applications
- 48
- Assignees
- 34
- Inventors
- 103
- Latest grant
- 27 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 2 |
| 2002 | 1 | 1 |
| 2003 | 1 | 0 |
| 2004 | 3 | 4 |
| 2005 | 1 | 1 |
| 2006 | 7 | 5 |
| 2007 | 2 | 2 |
| 2008 | 2 | 2 |
| 2009 | 1 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 3 |
| 2012 | 1 | 1 |
| 2013 | 3 | 2 |
| 2014 | 2 | 2 |
| 2015 | 1 | 2 |
| 2016 | 3 | 1 |
| 2017 | 0 | 4 |
| 2018 | 2 | 3 |
| 2019 | 4 | 5 |
| 2020 | 4 | 1 |
| 2021 | 4 | 1 |
| 2022 | 2 | 1 |
| 2023 | 1 | 2 |
| 2024 | 0 | 0 |
| 2025 | 0 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Micro-electro-mechanical system (MEMs) devices including sidewall stoppers27 Jan 2026US 12,534,362 B2Vanguard International Semiconductor Corporation
- Package structure of micro speaker and method for forming the same14 Nov 2023US 11,818,563 B2Fortemedia, Inc.
- Method for manufacturing micromechanical structures in a device wafer13 Dec 2022US 11,524,893 B2Murata Manufacturing Co., Ltd.
- Method for producing microstructures in a glass substrate5 Jul 2022US 11,377,387 B1Lpkf Laser & Electronics AG
- Method of addressing dissimilar etch rates28 Dec 2021US 11,211,258 B2InvenSense, Inc.
- Method of fabricating micro-electro-mechanical system (mems) device30 Apr 2026US 2026/0116744 A1Vanguard International Semiconductor Corporation
- Micro system and manufacturing method6 Feb 2025US 2025/0042725 A1Audio Pixels Ltd.
- Micro-electro-mechanical system (mems) devices and fabrication methods thereof21 Sep 2023US 2023/0294980 A1Vanguard International Semiconductor Corporation
- Package structure of micro speaker and method for forming the same27 Jul 2023US 2023/0239628 A1Fortemedia, Inc.
- Method for producing microstructures in a glass substrate30 Jun 2022US 2022/0204394 A1Lpkf Laser & Electronics AG
Most cited
By later US patents
- Method and apparatus for monitoring processes using multiple parameters of a semiconductor wafer processing system122US 5,910,011 AAPPLIED Materials.Inc. · 1999
- Method for fabricating microstructures with deep anisotropic etching of thick silicon wafers97US 6,787,052 B12004
- Method and devices for detecting the end point of plasma process70US 5,980,767 ATokyo Electron Limited · 1999
- Method and devices for detecting the end point of plasma process54US 5,728,253 ATokyo Electron Limited · 1998
- Suspended moving channels and channel actuators for microfluidic applications and method for making42US 6,180,536 B2Cornell Research Foundation, Inc. · 2001