B81C 1/00571
Avoid or control under-cutting
Official title: {Avoid or control under-cutting}
B81C1/00571 (Avoid or control under-cutting) appears on 69 US grants and 71 published applications in this corpus.
Search patents in B81C- Granted patents
- 69
- Published applications
- 71
- Assignees
- 43
- Inventors
- 140
- Latest grant
- 27 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 2 | 5 |
| 2003 | 2 | 0 |
| 2004 | 2 | 3 |
| 2005 | 3 | 1 |
| 2006 | 2 | 6 |
| 2007 | 2 | 1 |
| 2008 | 1 | 5 |
| 2009 | 1 | 1 |
| 2010 | 3 | 1 |
| 2011 | 3 | 4 |
| 2012 | 0 | 8 |
| 2013 | 6 | 1 |
| 2014 | 5 | 4 |
| 2015 | 3 | 4 |
| 2016 | 6 | 4 |
| 2017 | 4 | 4 |
| 2018 | 2 | 1 |
| 2019 | 2 | 0 |
| 2020 | 3 | 4 |
| 2021 | 1 | 4 |
| 2022 | 4 | 2 |
| 2023 | 1 | 3 |
| 2024 | 2 | 3 |
| 2025 | 3 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Micro-electro-mechanical system (MEMs) devices including sidewall stoppers27 Jan 2026US 12,534,362 B2Vanguard International Semiconductor Corporation
- Method for producing a bonding pad for a micromechanical sensor element2 Sep 2025US 12,404,170 B2Robert Bosch GmbH
- MEMS element and vibration-driven energy harvesting device26 Aug 2025US 12,398,032 B2Kabushiki Kaisha Saginomiya Seisakusho
- MEMS device built using the BEOL metal layers of a solid state semiconductor process28 Jan 2025US 12,209,009 B2Nanusens SL
- Undercut-free patterned aluminum nitride structure and methods for forming the same5 Nov 2024US 12,134,824 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of fabricating micro-electro-mechanical system (mems) device30 Apr 2026US 2026/0116744 A1Vanguard International Semiconductor Corporation
- Mems device built using the beol metal layers of a solid state semiconductor process24 Jul 2025US 2025/0236506 A1Nanusens SL
- Double notch etch to reduce under cut of micro electro-mechanical system (mems) devices14 Nov 2024US 2024/0375942 A1Calient Technologies, Inc.
- Undercut-free patterned aluminum nitride structure and methods for forming the same7 Nov 2024US 2024/0368746 A1Taiwan Semiconductor Manufacturing Company.Ltd
- MEMS Element and Vibration-Driven Energy Harvesting Device14 Mar 2024US 2024/0083740 A1Kabushiki Kaisha Saginomiya Seisakusho
Most cited
By later US patents
- Micromechanical component including function components suspended movably above a substrate73US 6,686,638 B2Robert Bosch GmbH · 2004
- Etching process for producing substantially undercut free silicon on insulator structures51US 6,071,822 APlasma-Therm LLC · 2000
- Method of making surface micro-machined accelerometer using silicon-on-insulator technology44US 5,747,353 ANational Semiconductor Corporation · 1998
- Sensor element with removal resistance region28US 5,998,816 AMitsubishi Denki Kabushiki Kaisha · 1999
- Manufacturing method for micromechanical component26US 6,187,607 B1Robert Bosch GmbH · 2001