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US 5,998,816 AGranted
Sensor element with removal resistance region
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsYoshiyuki Nakaki, Tomohiro Ishikawa, Masashi Ueno, Hisatoshi Hata, Masafumi Kimata
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Abstract
A sensor element provided with a silicon substrate having a semiconductor circuit, a sensing-element portion formed on the silicon substrate and connected to the semiconductor circuit, and a cavity portion formed by removing a silicon substrate portion below the sensing-element portion, in which a removal resistance region having resistance against substrate removal is provided in the silicon substrate between the semiconductor circuit and the cavity portion.
Claims6
A sensor element comprising:
- a silicon substrate having a semiconductor circuit;
- a sensing-element portion formed on the silicon substrate and being ohmically connected to the semiconductor circuit;
- a cavity portion formed by removing a silicon substrate portion below the sensing-element portion;
- and
- a removal resistance region having resistance against substrate removal provided in the silicon substrate between the semiconductor circuit and the cavity portion.
2 more elements
Dependencies are inferred from the claim text.