Manufacturing method for micromechanical component

A method for manufacturing a micromechanical component, the component including a first supporting layer, a second insulating layer and a third conductive layer, the method comprising the steps of:

• a) providing the second insulating layer on the first supporting layer, the second insulating layer having first patterned insulation regions and second patterned insulation regions;
• b) providing a first protective layer on an edge region of the first insulation regions and on a corresponding boundary region of the first supporting layer to form a resulting structure;
• c) providing the third conductive layer on the resulting structure;
• d) patterning a further structure of conductor paths and a functional structure of the component from the third conductive layer, the conductor paths extending on the first insulation regions, the functional structure being above the second insulation regions;
• and
• e) removing the second insulating layer in the second insulation regions, wherein, in the first insulation regions, the second insulating layer is protected by the first protective layer without being substantially removed from the second insulation regions.