Method for producing at least one first and one second micromirror device

A method for producing at least one first and one second micromirror device, the method comprising the following method steps:

• providing a silicon wafer, the silicon wafer being a plate-type silicon wafer having a front side and a rear side;
• applying a silicon oxide layer to at least the front side of the silicon wafer with a layer thickness of the silicon oxide layer in a range of 1 μm to 3 μm;
• removing the silicon oxide layer up to an outer surface of the silicon wafer, in such a way that at least one first separation region and at least one second separation region of the silicon oxide layer are generated, the first and the second separation region of the silicon oxide layer being arranged spatially separated from each other along a separation plane;
• applying a silicon layer with a layer thickness in a range of 5 μm to 50 μm, to the front side of the silicon wafer and to the first and second separation region of the silicon oxide layer;
• applying an etching mask to the rear side of the silicon wafer, the etching mask having a first opening along the separation plane of the first and second separation region of the silicon oxide layer;
• and
• removing the silicon layer and the silicon wafer, using an etching method, according to the etching mask on the rear side of the silicon wafer and according to the first and second separation region of the silicon oxide layer, so that at least one first and one second micromirror device are generated,
• wherein the etching mask further comprises at least one additional opening for separating a reinforcing structure of the first micromirror device into a first and second separation region of the reinforcing structure, and wherein the reinforcing structure comprises at least two reinforcing braces extending parallel to each other.