B81C 1/00611
Processes for the planarisation of structures
Official title: {Processes for the planarisation of structures (planarising depositions C23C, H10)}
B81C1/00611 (Processes for the planarisation of structures) appears on 65 US grants and 75 published applications in this corpus.
Search patents in B81C- Granted patents
- 65
- Published applications
- 75
- Assignees
- 58
- Inventors
- 181
- Latest grant
- 20 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 2 |
| 2002 | 3 | 2 |
| 2003 | 4 | 6 |
| 2004 | 3 | 2 |
| 2005 | 5 | 7 |
| 2006 | 1 | 6 |
| 2007 | 2 | 1 |
| 2008 | 2 | 5 |
| 2009 | 1 | 4 |
| 2010 | 4 | 2 |
| 2011 | 3 | 4 |
| 2012 | 3 | 2 |
| 2013 | 1 | 1 |
| 2014 | 1 | 4 |
| 2015 | 3 | 4 |
| 2016 | 4 | 6 |
| 2017 | 3 | 4 |
| 2018 | 5 | 2 |
| 2019 | 2 | 1 |
| 2020 | 5 | 2 |
| 2021 | 1 | 3 |
| 2022 | 1 | 0 |
| 2023 | 0 | 2 |
| 2024 | 2 | 2 |
| 2025 | 0 | 0 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Preventing electrode discontinuation on microdevice sidewall20 Jan 2026US 12,532,724 B2VueReal Inc.
- Laser-assisted material phase-change and expulsion micro-machining process3 Sep 2024US 12,077,432 B2Massachusetts Institute of Technology
- Flattening apparatus, article manufacturing method, flattening method, and imprinting apparatus27 Feb 2024US 11,915,948 B2Canon Kabushiki Kaisha
- Method for manufacturing semiconductor structure and planarization process thereof5 Jul 2022US 11,377,347 B2United Microelectronics Corp.
- Superstrate and methods of using the same25 May 2021US 11,018,018 B2Canon Kabushiki Kaisha
- Preventing electrode discontinuation on microdevice sidewall14 May 2026US 2026/0136906 A1VueReal Inc.
- Self-aligned air gap formation in microelectronics packages28 Mar 2024US 2024/0101413 A1
- Laser sealing and surface asperity controlling method with discontinuous laser pulses18 Jan 2024US 2024/0017353 A1Robert Bosch GmbH
- Atomic-smooth device with microstructure, and method for preparing same31 Aug 2023US 2023/0271825 A1
- Preventing electrode discontinuation on microdevice sidewall18 May 2023US 2023/0154790 A1VueReal Inc.
Most cited
By later US patents
- Chemical-mechanical polishing of recessed microelectromechanical devices181US 5,919,548 ASandia Corporation · 1999
- Continuous laminar fluid mixing in micro-electromechanical systems168US 6,520,197 B2The Regents of the University of California · 2003
- Use of chemical mechanical polishing in micromachining86US 5,804,084 ASandia Corporation · 1998
- Method of fabricating micro-electromechanical switches on CMOS compatible substrates83US 6,635,506 B2International Business Machines Corporation · 2003
- Methods for planarization and encapsulation of micromechanical devices in semiconductor processes81US 5,504,026 AAnalog Devices, Inc. · 1996