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US 12,532,724 B2Granted
Preventing electrode discontinuation on microdevice sidewall
AssigneeVueReal Inc.
InventorsGholamreza Chaji, Ehsanollah Fathi
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Abstract
This disclosure relates to the process of etching and treatment of side walls while processing microdevices. One aspect is to fill the device wall indentation with a polymer. The disclosure relates to a method and device with its structure to the process of etching and treatment of sidewalls. The methods of etching, coating, and curing are used.
Claims14
A method to planarize sidewalls of microdevices, the method comprising:
- coating a microdevice with a polymer;
- curing the polymer, wherein the curing has a reflow cycle;
- and
- removing the polymer by a dry etching process and leaving the polymer in a sidewall indentation to planarize the sidewalls.
1 more element
Dependencies are inferred from the claim text.