B81C 1/005
Bulk micromachining
Official title: {Bulk micromachining}
B81C1/005 (Bulk micromachining) appears on 43 US grants and 46 published applications in this corpus.
Search patents in B81C- Granted patents
- 43
- Published applications
- 46
- Assignees
- 38
- Inventors
- 110
- Latest grant
- 20 Jun 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 0 |
| 2002 | 3 | 0 |
| 2003 | 1 | 0 |
| 2004 | 0 | 2 |
| 2005 | 0 | 2 |
| 2006 | 2 | 3 |
| 2007 | 1 | 0 |
| 2008 | 2 | 0 |
| 2009 | 0 | 0 |
| 2010 | 2 | 4 |
| 2011 | 3 | 3 |
| 2012 | 0 | 3 |
| 2013 | 3 | 3 |
| 2014 | 3 | 4 |
| 2015 | 3 | 2 |
| 2016 | 4 | 0 |
| 2017 | 1 | 4 |
| 2018 | 3 | 1 |
| 2019 | 3 | 5 |
| 2020 | 1 | 3 |
| 2021 | 2 | 3 |
| 2022 | 2 | 0 |
| 2023 | 3 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 2 |
| 2026 | 0 | 2 |
By publication year. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Structure forming method and device20 Jun 2023US 11,679,976 B2Seiko Epson Corporation
- Method for manufacturing three-dimensionally structured member, method for manufacturing acceleration pickup, acceleration pickup, and acceleration sensor21 Feb 2023US 11,584,641 B2TOKYO KEIKl INC.
- Segmented pedestal for mounting device on chip3 Jan 2023US 11,542,153 B2Taiwan Semiconductor Manufacturing Company.Ltd
- MEMS transducing apparatus and method of fabricating the same2 Aug 2022US 11,401,159 B2Formosa Material Industrial Corp.
- Method for transferring a useful layer into a supporting substrate2 Aug 2022US 11,401,162 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Method of manufacturing a layered structure for a mems apparatus and mems apparatus having such a layered structure26 Feb 2026US 2026/0054980 A1OQmented GmbH
- Method for making a hollow structure, and micromechanical sensor having such a hollow structure12 Feb 2026US 2026/0042663 A1
- Method for forming a bore for a cavity arranged within a semiconductor layer stack1 May 2025US 2025/0136440 A1
- Laser micromachining of mems resonators from bulk optically transparent material20 Mar 2025US 2025/0091861 A1The Regents of the University of California
- Segmented pedestal for mounting device on chip28 Oct 2021US 2021/0331915 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Microneedle structure and production method therefor231US 6,533,949 B1Nanopass Ltd. · 2003
- Multilayered wafer with thick sacrificial layer using porous silicon or porous silicon oxide and fabrication method thereof71US 6,277,712 B1Samsung Electronics Co., Ltd. · 2001
- Microneedle structure and production method therefor54US 7,648,484 B2NanoPass Technologies Ltd. · 2010
- MEMS devices and methods of forming same46US 8,987,059 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Method and apparatus for manufacturing a micromechanical device35US 6,355,181 B1Surface Technology Systems Limited · 2002