B81C 1/00444
Surface micromachining, i.e. structuring layers on the substrate
Official title: {Surface micromachining, i.e. structuring layers on the substrate}
B81C1/00444 (Surface micromachining, i.e. structuring layers on the substrate) appears on 482 US grants and 596 published applications in this corpus.
Search patents in B81C- Granted patents
- 482
- Published applications
- 596
- Assignees
- 261
- Inventors
- 1,211
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 4 | 1 |
| 2002 | 5 | 11 |
| 2003 | 9 | 18 |
| 2004 | 10 | 39 |
| 2005 | 24 | 34 |
| 2006 | 15 | 32 |
| 2007 | 18 | 26 |
| 2008 | 22 | 23 |
| 2009 | 16 | 25 |
| 2010 | 15 | 21 |
| 2011 | 15 | 31 |
| 2012 | 20 | 19 |
| 2013 | 20 | 23 |
| 2014 | 29 | 26 |
| 2015 | 20 | 26 |
| 2016 | 24 | 28 |
| 2017 | 19 | 26 |
| 2018 | 33 | 33 |
| 2019 | 17 | 22 |
| 2020 | 31 | 31 |
| 2021 | 32 | 30 |
| 2022 | 23 | 21 |
| 2023 | 16 | 13 |
| 2024 | 15 | 13 |
| 2025 | 14 | 15 |
| 2026 | 10 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Three dimensional stacked microstructures for use in gyroscopes and other devices1 Sep 2026US 12,723,874 B2The Regents of the University of Michigan
- Process for manufacturing a microelectromechanical mirror device and microelectromechanical mirror device5 May 2026US 12,619,065 B2STMicroelectronics S,r.l.
- Method and device for locally removing and/or modifying a polymer material on a surface28 Apr 2026US 12,612,305 B2Robert Bosch GmbH
- Polymer-based microfabricated thermal ground plane21 Apr 2026US 12,607,413 B2Kelvin Thermal Technologies, Inc.
- Dual micro-electro mechanical system and manufacturing method thereof7 Apr 2026US 12,595,167 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for producing a silicon layer system with electrical connections27 Aug 2026US 2026/0250122 A1
- Method of manufacturing a microstructure6 Aug 2026US 2026/0225877 A1
- Dual micro-electro mechanical system and manufacturing method thereof23 Jul 2026US 2026/0209033 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Hybrid release layer for microdevice cartridge9 Jul 2026US 2026/0198265 A1VueReal Inc.
- Mems device and preparation therefor2 Jul 2026US 2026/0184559 A1Aac Acoustic Technologies (Shenzhen) Co., Ltd.
Most cited
By later US patents
- Release strategies for making transferable semiconductor structures, devices and device components321US 7,932,123 B2The Board of Trustees of the University of Illinois · 2011
- Planarized sacrificial layer for MEMS fabrication281US 8,278,802 B1RF Micro Devices, Inc. · 2012
- Release strategies for making transferable semiconductor structures, devices and device components208US 8,895,406 B2The Board of Trustees of the University of Illinois · 2014
- Anhydrous HF release of process for MEMS devices201US 7,365,016 B2DALSA Semiconductor Inc. · 2008
- Step and repeat imprint lithography systems197US 6,900,881 B2Molecular Imprints, Inc. · 2005