Process for manufacturing a microelectromechanical mirror device and microelectromechanical mirror device

A microelectromechanical scanning device, comprising:

• a semiconductor support structure defining a cavity;
• a movable plate partially closing the cavity and connected to the semiconductor support structure through elastic elements;
• a reflective element disposed on the movable plate;
• a plurality of actuator assemblies extending from the semiconductor support structure toward the movable plate, each actuator assembly comprising:
• a cantilever arm having a fixed end coupled to the semiconductor support structure and a free end coupled to the movable plate;
• and
• a piezoelectric stack on the cantilever arm;
• electrical contact pads disposed on the semiconductor support structure and electrically coupled to the piezoelectric stacks;
• and
• protective spacer elements disposed on the semiconductor support structure and protruding farther from a surface of the semiconductor support structure than both the electrical contact pads and the piezoelectric stacks:
• wherein the protective spacer elements comprise a dummy actuator having a dummy bottom electrode, a dummy piezoelectric region and a dummy top electrode, portions of a first passivation layer overlaying the dummy actuator, dummy lines formed by respective portions of a routing metallization layer, and portions of a second passivation layer covering the dummy lines, and wherein the protective spacer elements further comprise, on the portions of the second passivation layer covering the dummy lines, adhesion regions and dummy contacts formed from a metallization layer.