B81C 1/00468
Releasing structures
Official title: {Releasing structures}
B81C1/00468 (Releasing structures) appears on 308 US grants and 351 published applications in this corpus.
Search patents in B81C- Granted patents
- 308
- Published applications
- 351
- Assignees
- 161
- Inventors
- 649
- Latest grant
- 28 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 4 | 0 |
| 2002 | 3 | 10 |
| 2003 | 7 | 11 |
| 2004 | 7 | 16 |
| 2005 | 10 | 8 |
| 2006 | 12 | 15 |
| 2007 | 7 | 11 |
| 2008 | 12 | 11 |
| 2009 | 8 | 15 |
| 2010 | 9 | 13 |
| 2011 | 7 | 23 |
| 2012 | 17 | 10 |
| 2013 | 11 | 16 |
| 2014 | 20 | 17 |
| 2015 | 13 | 15 |
| 2016 | 16 | 21 |
| 2017 | 15 | 19 |
| 2018 | 25 | 23 |
| 2019 | 14 | 17 |
| 2020 | 22 | 14 |
| 2021 | 21 | 18 |
| 2022 | 13 | 12 |
| 2023 | 6 | 7 |
| 2024 | 8 | 11 |
| 2025 | 9 | 10 |
| 2026 | 7 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method and device for locally removing and/or modifying a polymer material on a surface28 Apr 2026US 12,612,305 B2Robert Bosch GmbH
- Polymer-based microfabricated thermal ground plane21 Apr 2026US 12,607,413 B2Kelvin Thermal Technologies, Inc.
- Dual micro-electro mechanical system and manufacturing method thereof7 Apr 2026US 12,595,167 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Process for manufacturing a micro-electro-mechanical device from a single semiconductor wafer and related MEMS device31 Mar 2026US 12,589,989 B2STMicroelectronics S,r.l.
- Hybrid release layer for microdevice cartridge31 Mar 2026US 12,593,656 B2VueReal Inc.
- Method for producing a silicon layer system with electrical connections27 Aug 2026US 2026/0250122 A1
- Method of manufacturing a microstructure6 Aug 2026US 2026/0225877 A1
- Dual micro-electro mechanical system and manufacturing method thereof23 Jul 2026US 2026/0209033 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Hybrid release layer for microdevice cartridge9 Jul 2026US 2026/0198265 A1VueReal Inc.
- Mems device and preparation therefor2 Jul 2026US 2026/0184559 A1Aac Acoustic Technologies (Shenzhen) Co., Ltd.
Most cited
By later US patents
- Planarized sacrificial layer for MEMS fabrication281US 8,278,802 B1RF Micro Devices, Inc. · 2012
- Anhydrous HF release of process for MEMS devices201US 7,365,016 B2DALSA Semiconductor Inc. · 2008
- Manufacture of MEMS structures in sealed cavity using dry-release MEMS device encapsulation191US 7,008,812 B1IC Mechanics, Inc. · 2006
- Micromechanical device and methods to fabricate same using hard mask resistant to structure release etch140US 8,440,523 B1International Business Machines Corporation · 2013
- Microcap wafer-level package126US 6,265,246 B1Agilent Technologies, Inc. · 2001