B81C 1/00484
Processes for releasing structures not provided for in group b81c1/00476
Official title: {Processes for releasing structures not provided for in group B81C1/00476}
B81C1/00484 (Processes for releasing structures not provided for in group b81c1/00476) appears on 61 US grants and 57 published applications in this corpus.
Search patents in B81C- Granted patents
- 61
- Published applications
- 57
- Assignees
- 46
- Inventors
- 158
- Latest grant
- 7 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 0 |
| 2002 | 3 | 5 |
| 2003 | 4 | 1 |
| 2004 | 4 | 5 |
| 2005 | 1 | 2 |
| 2006 | 3 | 4 |
| 2007 | 2 | 3 |
| 2008 | 6 | 2 |
| 2009 | 1 | 1 |
| 2010 | 2 | 3 |
| 2011 | 2 | 4 |
| 2012 | 2 | 1 |
| 2013 | 1 | 2 |
| 2014 | 4 | 1 |
| 2015 | 0 | 3 |
| 2016 | 1 | 1 |
| 2017 | 2 | 5 |
| 2018 | 4 | 3 |
| 2019 | 2 | 1 |
| 2020 | 2 | 1 |
| 2021 | 5 | 5 |
| 2022 | 3 | 1 |
| 2023 | 0 | 0 |
| 2024 | 1 | 2 |
| 2025 | 0 | 0 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Dual micro-electro mechanical system and manufacturing method thereof7 Apr 2026US 12,595,167 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Dual micro-electro mechanical system and manufacturing method thereof28 May 2024US 11,993,512 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for producing damper structures on a micromechanical wafer18 Oct 2022US 11,472,698 B2Robert Bosch GmbH
- Methods for manufacturing micromechanical components and method for manufacturing a mould insert component6 Sep 2022US 11,434,131 B2Csem Centre Suisse D'Electronique Et De Microtechnique SA—Recherche Et DéVeloppement
- Dual micro-electro mechanical system and manufacturing method thereof15 Mar 2022US 11,274,037 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Dual micro-electro mechanical system and manufacturing method thereof23 Jul 2026US 2026/0209033 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Active matrix programmable mirror31 Oct 2024US 2024/0359974 A1Obsidian Sensors, Inc.
- Dual micro-electro mechanical system and manufacturing method thereof8 Aug 2024US 2024/0262681 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Dual micro-electro mechanical system and manufacturing method thereof23 Jun 2022US 2022/0194783 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for producing damper structures on a micromechanical wafer21 Oct 2021US 2021/0323810 A1Robert Bosch GmbH
Most cited
By later US patents
- Microcap wafer-level package126US 6,265,246 B1Agilent Technologies, Inc. · 2001
- Microcap wafer-level package97US 6,376,280 B1Agilent Technologies, Inc. · 2002
- Microelectronic mechanical system and methods68US 7,049,164 B2Silicon Light Machines Corporation · 2006
- Process for manufacture of micro electromechanical devices having high electrical isolation67US 6,159,385 ARockwell Technologies, LLC · 2000
- Method of fabricating suspended single crystal silicon micro electro mechanical system (MEMS) devices64US 6,074,890 ARockwell Science Center, Inc. · 2000