Process for manufacture of micro electromechanical devices having high electrical isolation

A method for fabricating a micro electromechanical (MEM) component on a substrate comprising the steps of:

• Providing a first substrate;
• Providing a first layer of material on said first substrate;
• Providing a second substrate;
• Forming a composite structure having a single bead of adhesive polymer between said first layer of material and said second substrate;
• Etching said first substrate to expose said first layer of material;
• Etching said first layer of material to define a MEM component in said first layer of material;
• and
• Etching a portion of said adhesive to release said MEM component, so that said MEM component is supported by said first layer of material and said first layer of material, other than said MEM component, remains coupled to said second substrate by a remaining portion of said adhesive polymer layer.

A method for fabricating a micro electromechanical component on a substrate comprising the steps of:

• Providing a silicon substrate;
• Depositing a layer of semiconductor material on said silicon substrate;
• Providing a highly insulating substrate;
• Bonding said highly insulating substrate to said semiconductor material to form a composite structure with an adhesive polymer layer;
• Etching said silicon substrate to expose said semiconductor material;
• Etching said semiconductor material to define a micro electromechanical component;
• and
• Performing an isotropic etch to selectively undercut the adhesive polymer layer and to release the suspended portions of said micro electromechanical component, said micro electromechanical component supported by said semiconductor material and said semiconductor material, other than said micro electromechanical component, is coupled to said highly insulating substrate by a remaining portion of said adhesive polymer layer.

A method for fabricating a micro electromechanical component on a substrate comprising the steps of:

• Providing a silicon-on-insulator (SOI) substrate having a buried layer of insulating material;
• Providing a highly insulating substrate;
• Bonding said highly insulating substrate to said SOI substrate with a layer of adhesive polymer to form a composite structure;
• Etching said SOI substrate to expose at least a portion of said buried layer insulating material;
• Etching said buried layer insulating material to define a micro electromechanical component;
• and
• Selectively etching said adhesive polymer layer under said micro electromechanical component so said micro electromechanical component is supported by said SOI substrate and said SOI substrate, other than said micro electromechanical component, remains bonded to said highly insulating substrate by a remaining portion of said adhesive polymer layer.