Method for producing damper structures on a micromechanical wafer
AssigneeRobert Bosch GmbH
InventorsMichael Stumber, Stefan Apelt
Life of this patent
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Abstract
A method for producing damper structures on a micromechanical wafer. The method includes: providing an at least partially UV-transparent master mold for molding damper structures; inserting and pressing a micromechanical wafer into the master mold so that micromechanical structures in the wafer are aligned in relation to the damper structures; filling the master mold with UV-curing LSR and subsequent UV irradiation; and mold release and removal of the connected structure of the micromechanical wafer with attached dampers. A method for producing a singulated MEMS chip comprising a UV-cured damper is also described.
Claims3
A method for producing damper structures on a micromechanical wafer, comprising the following steps:
- A. providing an at least partially UV-transparent master mold for molding damper structures;
- B. inserting and pressing a micromechanical wafer into the master mold so that micromechanical structures in the wafer are aligned in relation to the damper structures;
- C. filling the master mold with UV-curing LSR, and subsequent to the filling, UV irradiating the UV-curing LSR;
- and
- D. releasing the mold and removing a connected structure of the micromechanical wafer with attached dampers.
A method for producing a singulated MEMS chip having a UV-cured damper, comprising the following steps:
- A. providing an at least partially UV-transparent master mold for molding damper structures;
- B. inserting and pressing a micromechanical wafer into the master mold so that micromechanical structures in the wafer are aligned in relation to the damper structures;
- C. filling the master mold with UV-curing LSR, and subsequent to the filling, UV irradiating the UV-curing LSR;
- D. releasing the mold and removing a connected structure of the micromechanical wafer with attached dampers;
- and
- E. after step D, singulating the micromechanical wafer including attached dampers into chips by sawing the wafer.
Dependencies are inferred from the claim text.