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US 11,993,512 B2Granted
Dual micro-electro mechanical system and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYang-Che Chen, Victor Chiang Liang, Chen-Hua Lin, Chwen-Ming Liu, Huang-Wen Tseng, Yi-Chuan Teng
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Abstract
A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.
Claims20
A micro electro mechanical system (MEMS), comprising:
- a circuit substrate;
- a first MEMS structure disposed over the circuit substrate;
- a first insulating layer disposed between the circuit substrate and the first MEMS structure;
- a second MEMS structure disposed over the first MEMS structure;
- and
- a second insulating layer disposed between the first MEMS structure and the second MEMS structure,
- wherein the first MEMS structure includes a first anchor,
- the second MEMS structure includes a second anchor, and
- the MEMS further comprises a main via electrode passing through the first anchor and the second anchor and electrically connected to the circuit substrate.
6 more elements
A micro electro mechanical system (MEMS), comprising:
- a circuit substrate;
- a first MEMS structure disposed over the circuit substrate;
- a first insulating layer disposed between the circuit substrate and the first MEMS structure;
- a second MEMS structure disposed over the first MEMS structure;
- a second insulating layer disposed between the first MEMS structure and the second MEMS structure;
- and
- a cover disposed over the second MEMS structure, wherein:
- the first MEMS structure includes a capacitance sensor for detecting horizontal movement, and
- the first MEMS structure and the second MEMS structure are configured to detect vertical movement.
6 more elements
A micro electro mechanical system (MEMS), comprising:
- a circuit substrate;
- a first MEMS structure disposed over the circuit substrate;
- a first insulating layer disposed between the circuit substrate and the first MEMS structure;
- a second MEMS structure disposed over the first MEMS structure;
- a second insulating layer disposed between the first MEMS structure and the second MEMS structure;
- and
- a cover disposed over the second MEMS structure,
- wherein the circuit substrate includes a signal processing circuit for processing a signal transmitted from at least one of the first MEMS structure or the second MEMS structure,
- wherein:
- the first MEMS structure includes a first anchor, a second anchor, a first proof mass, first comb electrodes coupled to the second anchor and second comb electrodes coupled to the first proof mass,
- the second MEMS structure includes a third anchor, a second proof mass and third comb electrodes coupled to the second anchor,
- the third anchor and the first anchor are coupled to the signal processing circuit by a first via electrode, and
- the second anchor is coupled to the signal processing circuit by a second via electrode.
10 more elements
Dependencies are inferred from the claim text.