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US 2022/0194783 A1Published application
Dual micro-electro mechanical system and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYang-Che CHEN, Victor Chiang LIANG, Chen-Hua LIN, Chwen-Ming LIU, Huang-Wen TSENG, Yi-Chuan TENG
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Abstract
A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.
Claims20
A micro electro mechanical system (MEMS), comprising:
- a circuit substrate;
- a first MEMS structure disposed over the circuit substrate;
- a first insulating layer disposed between the circuit substrate and the first MEMS structure;
- a second MEMS structure disposed over the first MEMS structure;
- and
- a second insulating layer disposed between the first MEMS structure and the second MEMS structure.
3 more elements
A micro electro mechanical system (MEMS), comprising:
- a circuit substrate;
- a first MEMS structure disposed over the circuit substrate;
- a first insulating layer disposed between the circuit substrate and the first MEMS structure;
- a second MEMS structure disposed over the first MEMS structure;
- a second insulating layer disposed between the first MEMS structure and the second MEMS structure;
- and
- a cover disposed over the second MEMS structure, wherein:
- the first MEMS structure includes a capacitance censor for detecting horizontal movement, and
- the first MEMS structure and the second MEMS structure are configured to detect vertical movement.
6 more elements
A micro electro mechanical system (MEMS), comprising:
- a circuit substrate;
- a first MEMS structure disposed over the circuit substrate;
- a first insulating layer disposed between the circuit substrate and the first MEMS structure;
- a second MEMS structure disposed over the first MEMS structure;
- a second insulating layer disposed between the first MEMS structure and the second MEMS structure;
- and
- a cover disposed over the second MEMS structure,
- wherein the circuit substrate includes a signal processing circuit for processing a signal transmitted from at least one of the first MEMS structure or the second MEMS structure.
5 more elements
Dependencies are inferred from the claim text.