B81B 2207/00
Microstructural systems or auxiliary parts thereof
B81B2207/00 (Microstructural systems or auxiliary parts thereof) appears on 2,525 US grants and 3,052 published applications in this corpus.
Search patents in B81B- Granted patents
- 2,525
- Published applications
- 3,052
- Assignees
- 736
- Inventors
- 4,462
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 3 | 0 |
| 1998 | 8 | 0 |
| 1999 | 5 | 0 |
| 2000 | 6 | 0 |
| 2001 | 5 | 7 |
| 2002 | 12 | 15 |
| 2003 | 10 | 20 |
| 2004 | 22 | 38 |
| 2005 | 28 | 42 |
| 2006 | 17 | 33 |
| 2007 | 23 | 58 |
| 2008 | 25 | 71 |
| 2009 | 36 | 59 |
| 2010 | 55 | 100 |
| 2011 | 71 | 129 |
| 2012 | 88 | 106 |
| 2013 | 113 | 132 |
| 2014 | 136 | 155 |
| 2015 | 150 | 160 |
| 2016 | 157 | 204 |
| 2017 | 209 | 247 |
| 2018 | 183 | 206 |
| 2019 | 205 | 189 |
| 2020 | 193 | 204 |
| 2021 | 157 | 179 |
| 2022 | 149 | 154 |
| 2023 | 115 | 159 |
| 2024 | 122 | 137 |
| 2025 | 125 | 144 |
| 2026 | 88 | 104 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- B81B 2207/01Comprising a micromechanical device connected to control or processing electronics, i.e. smart-memsIndexing code1,123
- B81B 2207/09PackagesIndexing code981
- B81B 2207/07InterconnectsIndexing code715
- B81B 2207/05ArraysIndexing code227
- B81B 2207/03Electronic circuits for micromechanical devices which are not application specificIndexing code111
- B81B 2207/11Structural features, others than packages, for protecting a device against environmental influencesIndexing code97
- B81B 2207/99Microstructural systems or auxiliary parts thereof not provided for in b81b2207/01 -Indexing code34
Recent patents
- MEMS structure including a buried cavity with antistiction protuberances, and manufacturing methods thereof6 Oct 2026US 12,753,067 B2STMicroelectronics S,r.l.
- Device, system, method, and computer product for detecting and evaluating environmental quantities and events with modular approach and variable complexity6 Oct 2026US 12,754,529 B2STMicroelectronics S,r.l.
- Micro-electro-mechanical system and manufacturing method thereof29 Sep 2026US 12,747,154 B2Beijing BOE Technology Development Co., Ltd.
- Wafer level package for device29 Sep 2026US 12,747,155 B2Teknologian tutkimuskeskus VTT Oy
- Inertial measurement unit22 Sep 2026US 12,741,864 B2Seiko Epson Corporation
- Packaging method for mems acoustic device structure, mems acoustic device packaging structure and mems chip packaging method for acoustic device8 Oct 2026US 2026/0307982 A1Hefei Smat Technology Co., Ltd.
- Mems device1 Oct 2026US 2026/0296877 A1Infineon Technologies AG
- Electronic devices and methods of manufacturing electronic devices1 Oct 2026US 2026/0296878 A1Amkor Technology Singapore Holding Pte. Ltd.
- Micro-electro-mechanical system package and fabrication method thereof1 Oct 2026US 2026/0296879 A1Vanguard International Semiconductor Corporation
- Wafer level proximity sensor and method of making same1 Oct 2026US 2026/0296880 A1STMicroelectronics International N. V.
Most cited
By later US patents
- Lithography device for semiconductor circuit pattern generator287US 7,242,012 B2Elm Technology Corporation · 2007
- MEMS and CMOS integration with low-temperature bonding243US 9,394,161 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- CMOS-MEMS device structure, bonding mesa structure and associated method235US 9,656,852 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Methods of making, positioning and orienting nanostructures, nanostructure arrays and nanostructure devices234US 6,962,823 B2Nanosys, Inc. · 2005
- Methods of positioning and/or orienting nanostructures233US 6,872,645 B2Nanosys, Inc. · 2005