B81B 2207/11
Structural features, others than packages, for protecting a device against environmental influences
B81B2207/11 (Structural features, others than packages, for protecting a device against environmental influences) appears on 97 US grants and 131 published applications in this corpus.
Search patents in B81B- Granted patents
- 97
- Published applications
- 131
- Assignees
- 74
- Inventors
- 322
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 0 |
| 2005 | 1 | 3 |
| 2006 | 1 | 1 |
| 2007 | 2 | 2 |
| 2008 | 1 | 2 |
| 2009 | 1 | 1 |
| 2010 | 1 | 1 |
| 2011 | 2 | 3 |
| 2012 | 1 | 1 |
| 2013 | 4 | 5 |
| 2014 | 1 | 6 |
| 2015 | 3 | 6 |
| 2016 | 3 | 7 |
| 2017 | 7 | 10 |
| 2018 | 10 | 5 |
| 2019 | 12 | 8 |
| 2020 | 7 | 13 |
| 2021 | 6 | 8 |
| 2022 | 4 | 5 |
| 2023 | 7 | 17 |
| 2024 | 3 | 11 |
| 2025 | 10 | 11 |
| 2026 | 7 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- MEMS structure including a buried cavity with antistiction protuberances, and manufacturing methods thereof6 Oct 2026US 12,753,067 B2STMicroelectronics S,r.l.
- MEMS pressure sensor built using the beol metal layers of a solid-state semiconductor process11 Aug 2026US 12,703,621 B2Nanusens SL
- Electronic device14 Jul 2026US 12,684,276 B2Merry Electronics(Shenzhen) Co., Ltd.
- Piezoelectric MEMS device with thermal compensation from one or more compensation layers9 Jun 2026US 12,649,653 B2Skyworks Global Pte. Ltd.
- High accuracy temperature-compensated piezoresistive position sensing system2 Jun 2026US 12,645,069 B2ASML Netherlands B. V.
- Mems device1 Oct 2026US 2026/0296877 A1Infineon Technologies AG
- Out-of-plane micro-electromechanical device with reinforced stopper and method for manufacturing a micro-electromechanical device25 Jun 2026US 2026/0176126 A1STMicroelectronics International N. V.
- Stacked die with stepped surface18 Jun 2026US 2026/0167483 A1InvenSense, Inc.
- Mems device9 Apr 2026US 2026/0097951 A1Infineon Technologies AG
- Barrier structure within a microelectronic enclosure4 Dec 2025US 2025/0368501 A1Texas Instruments Incorporated
Most cited
By later US patents
- Encapsulants for protecting MEMS devices during post-packaging release etch116US 6,956,283 B12005
- High temperature environment tool system and method81US 7,017,662 B2Halliburton Energy Services.Inc. · 2006
- High temperature electronic devices35US 7,301,223 B2Halliburton Energy Services.Inc. · 2007
- Superhydrophobic and superoleophobic nanosurfaces34US 9,956,743 B2The Regents of the University of California · 2018
- Atomic layer deposition on micro-mechanical devices25US 7,426,067 B1The Regents of the University of Colorado · 2008