B81B 2207/115
Protective layers applied directly to the device before packaging
B81B2207/115 (Protective layers applied directly to the device before packaging) appears on 62 US grants and 74 published applications in this corpus.
Search patents in B81B- Granted patents
- 62
- Published applications
- 74
- Assignees
- 52
- Inventors
- 189
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 0 |
| 2005 | 1 | 3 |
| 2006 | 1 | 1 |
| 2007 | 2 | 1 |
| 2008 | 1 | 2 |
| 2009 | 1 | 1 |
| 2010 | 1 | 1 |
| 2011 | 2 | 3 |
| 2012 | 1 | 1 |
| 2013 | 4 | 5 |
| 2014 | 1 | 4 |
| 2015 | 2 | 4 |
| 2016 | 2 | 3 |
| 2017 | 6 | 7 |
| 2018 | 6 | 4 |
| 2019 | 10 | 3 |
| 2020 | 3 | 6 |
| 2021 | 2 | 6 |
| 2022 | 2 | 1 |
| 2023 | 4 | 8 |
| 2024 | 1 | 3 |
| 2025 | 4 | 4 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Piezoelectric MEMS device with thermal compensation from one or more compensation layers9 Jun 2026US 12,649,653 B2Skyworks Global Pte. Ltd.
- Process for manufacturing a micro-electro-mechanical device from a single semiconductor wafer and related MEMS device31 Mar 2026US 12,589,989 B2STMicroelectronics S,r.l.
- MEMS module and method of manufacturing mems module14 Oct 2025US 12,441,605 B2Rohm Co., Ltd.
- Micro-electromechanical packaging structure30 Sep 2025US 12,428,293 B2Merry Electronics(Shenzhen) Co., Ltd.
- Piezoelectric MEMS device with thermal compensation from different material thicknesses2 Sep 2025US 12,404,167 B2Skyworks Global Pte. Ltd.
- Out-of-plane micro-electromechanical device with reinforced stopper and method for manufacturing a micro-electromechanical device25 Jun 2026US 2026/0176126 A1STMicroelectronics International N. V.
- Stacked die with stepped surface18 Jun 2026US 2026/0167483 A1InvenSense, Inc.
- Methods and apparatus for electronic device packaging9 Oct 2025US 2025/0313454 A1
- Asymmetric filler as temperature transient fix2 Oct 2025US 2025/0304430 A1Rosemount Aerospace Inc.
- Acoustic sensor devices with multiple sensing elements26 Jun 2025US 2025/0206600 A1Soundskrit Inc.
Most cited
By later US patents
- Encapsulants for protecting MEMS devices during post-packaging release etch116US 6,956,283 B12005
- High temperature environment tool system and method81US 7,017,662 B2Halliburton Energy Services.Inc. · 2006
- High temperature electronic devices35US 7,301,223 B2Halliburton Energy Services.Inc. · 2007
- Atomic layer deposition on micro-mechanical devices25US 7,426,067 B1The Regents of the University of Colorado · 2008
- Pressure sensor structure16US 6,058,781 AUnisia Jecs Corporation · 2000