MEMS module and method of manufacturing mems module

A method of manufacturing a MEMS module, comprising:

• forming a plurality of grooves in a semiconductor layer included in a substrate;
• forming a hollow portion by etching the semiconductor layer from bottom surfaces of the grooves in a direction perpendicular to a depth direction of the grooves to connect the grooves and performing a heat treatment on the semiconductor layer so that a portion of the semiconductor layer melted by the heat treatment fills both ends of the grooves in the depth direction;
• forming an upper layer portion which is a portion of a movable portion adjoining the hollow portion when viewed in a thickness direction of the substrate;
• forming a first MEMS element and a second MEMS element by forming a film formation portion which is a portion of the movable portion stacked on the upper layer portion in the thickness direction of the substrate;
• and
• forming an electronic component to which output signals of the first MEMS element and the second MEMS element on the substrate are inputted,
• wherein the movable portion is formed so that a film thickness of the movable portion adjoining the hollow portion of the second MEMS element is larger than a film thickness of the movable portion adjoining the hollow portion of the first MEMS element.