B81B 2207/07
Interconnects
B81B2207/07 (Interconnects) appears on 715 US grants and 891 published applications in this corpus.
Search patents in B81B- Granted patents
- 715
- Published applications
- 891
- Assignees
- 305
- Inventors
- 1,533
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 5 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 3 | 4 |
| 2002 | 5 | 3 |
| 2003 | 4 | 10 |
| 2004 | 10 | 14 |
| 2005 | 9 | 7 |
| 2006 | 4 | 8 |
| 2007 | 7 | 22 |
| 2008 | 4 | 16 |
| 2009 | 12 | 16 |
| 2010 | 14 | 28 |
| 2011 | 27 | 45 |
| 2012 | 24 | 22 |
| 2013 | 30 | 28 |
| 2014 | 34 | 27 |
| 2015 | 25 | 30 |
| 2016 | 39 | 61 |
| 2017 | 66 | 100 |
| 2018 | 53 | 57 |
| 2019 | 70 | 43 |
| 2020 | 56 | 63 |
| 2021 | 30 | 54 |
| 2022 | 46 | 37 |
| 2023 | 30 | 39 |
| 2024 | 38 | 51 |
| 2025 | 40 | 59 |
| 2026 | 24 | 47 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Micro-electro-mechanical system and manufacturing method thereof29 Sep 2026US 12,747,154 B2Beijing BOE Technology Development Co., Ltd.
- Microscale flexible strain sensor8 Sep 2026US 12,729,106 B2Carnegie Mellon University
- Resonance device with anti-diffusion layer and resonance device manufacturing method25 Aug 2026US 12,719,443 B2Murata Manufacturing Co., Ltd.
- MEMS pressure sensor11 Aug 2026US 12,704,427 B2MEI Micro, Inc.
- Decoupling method for semiconductor device23 Jun 2026US 12,662,371 B2STMicroelectronics International N. V.
- Packaging method for mems acoustic device structure, mems acoustic device packaging structure and mems chip packaging method for acoustic device8 Oct 2026US 2026/0307982 A1Hefei Smat Technology Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices1 Oct 2026US 2026/0296878 A1Amkor Technology Singapore Holding Pte. Ltd.
- Micro-electro-mechanical system package and fabrication method thereof1 Oct 2026US 2026/0296879 A1Vanguard International Semiconductor Corporation
- Sound Producing Device and Sound Producing Package17 Sep 2026US 2026/0274652 A1xMEMS Labs, Inc.
- Process flow for thin contactless thermal sensors17 Sep 2026US 2026/0276451 A1STMicroelectronics International N. V.
Most cited
By later US patents
- Lithography device for semiconductor circuit pattern generator287US 7,242,012 B2Elm Technology Corporation · 2007
- MEMS and CMOS integration with low-temperature bonding243US 9,394,161 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Micro-electromechanical system device191US 6,384,353 B1Motorola, Inc. · 2002
- Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates178US 6,815,739 B2Corporation for National Research Initiatives · 2004
- Bonded structures150US 10,522,499 B2Invensas Bonding Technologies, Inc. · 2019