B81B 2207/01
Comprising a micromechanical device connected to control or processing electronics, i.e. smart-mems
Official title: comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
B81B2207/01 (Comprising a micromechanical device connected to control or processing electronics, i.e. smart-mems) appears on 1,123 US grants and 1,358 published applications in this corpus.
Search patents in B81B- Granted patents
- 1,123
- Published applications
- 1,358
- Assignees
- 361
- Inventors
- 2,098
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 1 |
| 2002 | 2 | 1 |
| 2003 | 1 | 6 |
| 2004 | 3 | 11 |
| 2005 | 6 | 10 |
| 2006 | 7 | 6 |
| 2007 | 6 | 8 |
| 2008 | 9 | 23 |
| 2009 | 6 | 18 |
| 2010 | 18 | 23 |
| 2011 | 15 | 46 |
| 2012 | 23 | 36 |
| 2013 | 40 | 39 |
| 2014 | 47 | 74 |
| 2015 | 52 | 72 |
| 2016 | 73 | 107 |
| 2017 | 112 | 160 |
| 2018 | 106 | 111 |
| 2019 | 120 | 97 |
| 2020 | 109 | 105 |
| 2021 | 81 | 83 |
| 2022 | 74 | 90 |
| 2023 | 62 | 71 |
| 2024 | 54 | 47 |
| 2025 | 57 | 64 |
| 2026 | 34 | 49 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- B81B 2207/012The micromechanical device and the control or processing electronics being separate partsIndexing code767
- B81B 2207/015The micromechanical device and the control or processing electronics being integrated onIndexing code382
- B81B 2207/017Smart-mems not provided for in b81b2207/012 - b81b2207/015Indexing code21
Recent patents
- Device, system, method, and computer product for detecting and evaluating environmental quantities and events with modular approach and variable complexity6 Oct 2026US 12,754,529 B2STMicroelectronics S,r.l.
- Inertial measurement unit22 Sep 2026US 12,741,864 B2Seiko Epson Corporation
- Protection of sensing element during moulding15 Sep 2026US 12,736,428 B2Melexis Technologies SA
- MEMS device with integrated CMOS circuit8 Sep 2026US 12,729,111 B23C Project Management Limited
- Micro-electro-mechanical systems and preparation method thereof25 Aug 2026US 12,715,762 B2Huawei Technologies Co., Ltd.
- Packaging method for mems acoustic device structure, mems acoustic device packaging structure and mems chip packaging method for acoustic device8 Oct 2026US 2026/0307982 A1Hefei Smat Technology Co., Ltd.
- Sound Producing Device and Sound Producing Package17 Sep 2026US 2026/0274652 A1xMEMS Labs, Inc.
- Process flow for thin contactless thermal sensors17 Sep 2026US 2026/0276451 A1STMicroelectronics International N. V.
- Foundry-compatible process for integrated micro-speaker and microphone17 Sep 2026US 2026/0281642 A1Vibrant Microsystems Inc.
- Integrated device package with carrier17 Sep 2026US 2026/0282981 A1Skyworks Solutions, Inc.
Most cited
By later US patents
- MEMS and CMOS integration with low-temperature bonding243US 9,394,161 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- CMOS-MEMS device structure, bonding mesa structure and associated method235US 9,656,852 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Methods of making, positioning and orienting nanostructures, nanostructure arrays and nanostructure devices234US 6,962,823 B2Nanosys, Inc. · 2005
- Methods of positioning and/or orienting nanostructures233US 6,872,645 B2Nanosys, Inc. · 2005
- Bonded structures181US 10,002,844 B1Invensas Bonding Technologies, Inc. · 2018