Protection of sensing element during moulding

A method of providing a sensor package, the method comprising:

• providing an active element comprising a first region comprising a sensing structure, and a second region being opposite to the first region, the second region comprising at least one contact pad, and at least one conductive line wherein the projection of the conductive line on the active element corresponds to a portion of an external surface of the active element, for routing signals from the sensing element to the at least one contact pad,
• providing an insert covering the first region,
• forming a package by providing a moulding compound for covering the second region including a portion of the at least one conductive line, wherein the insert impedes moulding compound from reaching at least the first region, so that the active element extends between an open volume and a packaged volume encapsulated by moulding compound,
• the method further comprising providing at least one dummy track laterally between the conducive lines and adjacent to the conductive lines extending along at least the first region of the active element, wherein the at least one dummy track rises the surface of the active element at least to the same height as the portion of the external surface corresponding to the conductive line, for protecting the active element from damages by reducing pressure of the insert onto the conductive lines.