B81B 2207/015
The micromechanical device and the control or processing electronics being integrated on
Official title: the micromechanical device and the control or processing electronics being integrated on the same substrate
B81B2207/015 (The micromechanical device and the control or processing electronics being integrated on) appears on 382 US grants and 457 published applications in this corpus.
Search patents in B81B- Granted patents
- 382
- Published applications
- 457
- Assignees
- 181
- Inventors
- 811
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 1 |
| 2002 | 2 | 1 |
| 2003 | 0 | 4 |
| 2004 | 3 | 8 |
| 2005 | 4 | 6 |
| 2006 | 7 | 3 |
| 2007 | 3 | 5 |
| 2008 | 6 | 10 |
| 2009 | 4 | 4 |
| 2010 | 7 | 12 |
| 2011 | 8 | 33 |
| 2012 | 13 | 14 |
| 2013 | 26 | 17 |
| 2014 | 21 | 29 |
| 2015 | 25 | 26 |
| 2016 | 28 | 36 |
| 2017 | 32 | 44 |
| 2018 | 31 | 24 |
| 2019 | 25 | 23 |
| 2020 | 29 | 27 |
| 2021 | 19 | 24 |
| 2022 | 19 | 21 |
| 2023 | 19 | 28 |
| 2024 | 15 | 15 |
| 2025 | 19 | 20 |
| 2026 | 11 | 22 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Inertial measurement unit22 Sep 2026US 12,741,864 B2Seiko Epson Corporation
- MEMS device with integrated CMOS circuit8 Sep 2026US 12,729,111 B23C Project Management Limited
- MEMS pressure sensor11 Aug 2026US 12,704,427 B2MEI Micro, Inc.
- Decoupling method for semiconductor device23 Jun 2026US 12,662,371 B2STMicroelectronics International N. V.
- High accuracy temperature-compensated piezoresistive position sensing system2 Jun 2026US 12,645,069 B2ASML Netherlands B. V.
- Foundry-compatible process for integrated micro-speaker and microphone17 Sep 2026US 2026/0281642 A1Vibrant Microsystems Inc.
- Micromechanical sensor device and corresponding production method3 Sep 2026US 2026/0257909 A1
- Mems microphone and mems accelerometer on a single substrate27 Aug 2026US 2026/0250120 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Asic capped double layer mems platform20 Aug 2026US 2026/0242213 A1Murata Manufacturing Co., Ltd.
- Microelectromechanical system20 Aug 2026US 2026/0242214 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Methods of making, positioning and orienting nanostructures, nanostructure arrays and nanostructure devices234US 6,962,823 B2Nanosys, Inc. · 2005
- Methods of positioning and/or orienting nanostructures233US 6,872,645 B2Nanosys, Inc. · 2005
- Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates178US 6,815,739 B2Corporation for National Research Initiatives · 2004
- Microfabricated structures with trench-isolation using bonded-substrates and cavities150US 6,433,401 B1Analog Devices IMI, Inc. · 2002
- Micromechanical device and methods to fabricate same using hard mask resistant to structure release etch140US 8,440,523 B1International Business Machines Corporation · 2013