B81B 2207/017
Smart-mems not provided for in b81b2207/012 - b81b2207/015
Official title: Smart-MEMS not provided for in B81B2207/012 - B81B2207/015
B81B2207/017 (Smart-mems not provided for in b81b2207/012 - b81b2207/015) appears on 21 US grants and 25 published applications in this corpus.
Search patents in B81B- Granted patents
- 21
- Published applications
- 25
- Assignees
- 17
- Inventors
- 71
- Latest grant
- 6 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 1 | 1 |
| 2008 | 0 | 1 |
| 2009 | 0 | 1 |
| 2010 | 2 | 3 |
| 2011 | 2 | 0 |
| 2012 | 1 | 1 |
| 2013 | 1 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 3 |
| 2016 | 0 | 0 |
| 2017 | 2 | 3 |
| 2018 | 2 | 0 |
| 2019 | 3 | 3 |
| 2020 | 0 | 2 |
| 2021 | 1 | 0 |
| 2022 | 1 | 3 |
| 2023 | 0 | 2 |
| 2024 | 2 | 0 |
| 2025 | 2 | 0 |
| 2026 | 1 | 0 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Protective bondline control structure6 Jan 2026US 12,515,944 B2Texas Instruments Incorporated
- Compact enhanced sensitivity temperature sensor using an encapsulated clamped-clamped MEMS beam resonator22 Jul 2025US 12,365,580 B2King Abdullah University of Science and Technology
- Semiconductor device and method for manufacturing a semiconductor device3 Jun 2025US 12,322,717 B2Ams AG
- MEMS sensor as well as method for operating a mems sensor19 Nov 2024US 12,145,840 B2Robert Bosch GmbH
- Sensor module having conductive bonding members with varying melting points and young's moduli4 Jun 2024US 12,000,857 B2Seiko Epson Corporation
- Compact enhanced sensitivity temperature sensor using an encapsulated clamped-clamped mems beam resonator13 Jul 2023US 2023/0219804 A1King Abdullah University of Science and Technology
- Protective bondline control structure2 Mar 2023US 2023/0064645 A1Texas Instruments Incorporated
- Sensor module25 Aug 2022US 2022/0268806 A1Seiko Epson Corporation
- Semiconductor device and method for manufacturing a semiconductor device14 Jul 2022US 2022/0223554 A1Ams AG
- Mems sensor as well as method for operating a mems sensor13 Jan 2022US 2022/0009769 A1Robert Bosch GmbH
Most cited
By later US patents
- Stacked MEMS device22US 7,928,584 B2Analog Devices, Inc. · 2011
- Stacked MEMS device18US 7,642,657 B2Analog Devices, Inc. · 2010
- Sound producing device13US 10,425,732 B1xMEMS Labs, Inc. · 2019
- Sensor unit including a decoupling structure and manufacturing method therefor8US 9,926,188 B2Robert Bosch GmbH · 2018
- MEMS micro mirrors driven by electrodes fabricated on another substrate5US 7,203,393 B2Movaz Networks, Inc. · 2007