Protective bondline control structure
AssigneeTexas Instruments Incorporated
InventorsGanapathy Subramaniam Sivakumar, Chad Alan McKay
Life of this patent
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Abstract
In described examples, apparatus includes a first substrate that delimits a surface of a cavity and a bondline structure arranged along a periphery of the cavity, where the bondline structure extends from the first substrate, and the bondline structure configured to bond with an interposer arranged on a second substrate. The apparatus also includes a diffusion barrier on the first substrate, the diffusion barrier configured to contact the interposer and impede a contaminant against migrating from the bondline structure and entering the cavity.
Claims20
Apparatus comprising:
- a first substrate that delimits a surface of a cavity;
- a bondline structure arranged along a periphery of the cavity, wherein the bondline structure extends from the first substrate, the bondline structure configured to bond with an interposer arranged on a second substrate;
- and
- a diffusion barrier on the first substrate, the diffusion barrier configured to:
- contact the interposer;
- and
- impede a contaminant against migrating from the bondline structure and entering the cavity.
An apparatus comprising:
- a first substrate that delimits a first boundary of a headspace;
- a second substrate that delimits a second boundary of the headspace, wherein the second boundary is opposite to the first boundary;
- an interposer extending from the second substrate and that delimits a peripheral boundary of the headspace;
- a bondline structure extending between the first substrate and the interposer, the bondline structure configured to bond the first substrate to the second substrate;
- and
- a diffusion barrier between the interposer and the first substrate, the diffusion barrier configured to impede a contaminant from the bondline structure against contacting an element within the headspace.
A method, comprising:
- arranging an interposer extending from a first substrate and that delimits a peripheral boundary of a cavity;
- arranging a bondline structure extending between a second substrate and the interposer;
- bonding the first and second substrates along the bondline structure;
- and
- arranging a diffusion barrier between the interposer and the first substrate.
Dependencies are inferred from the claim text.