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US 7,928,584 B2Granted
Stacked MEMS device
AssigneeAnalog Devices, Inc.
InventorsLiam O Suilleabhain, Raymond Goggin, Eva Murphy, Kieran P. Harney
Life of this patent
Estimating the term…
Abstract
A MEMS apparatus has a MEMS device sandwiched between a base and a circuit chip. The movable member of the MEMS device is attached at the side up against the circuit chip. The movable member may be mounted on a substrate of the MEMS device or formed directly on a passivation layer on the circuit chip. The circuit chip provides control signals to the MEMS device through wire bonds, vias through the MEMS device or a conductive path such as solder balls external to the MEMS device.
Claims24
A MEMS device comprising:
- a circuit chip having an application specific integrated circuit and a passivated surface;
- a MEMS microstructure formed on the passivated surface of the circuit chip;
- a cap over the MEMS microstructure;
- a first conductive path providing electrical communication between the MEMS microstructure and an external surface of the cap;
- and
- a second conductive path extending from the circuit chip out beyond the external surface of the cap.
3 more elements
A MEMS apparatus comprising:
- a base having electrical interconnects;
- a circuit chip having an application specific integrated circuit and a passivated surface;
- a MEMS microstructure formed on the passivated surface of the circuit chip;
- a cap over the MEMS microstructure, the cap being secured to the base;
- a first conductive path providing electrical communication between the base and the MEMS microstructure;
- and
- a second conductive path providing electrical communication between the circuitry of the circuit chip and electrical interconnects of the base.
4 more elements
A switch comprising:
- a MEMS device having a cap side, a substrate side and a movable member, the movable member attached at the substrate side and enclosed within a chamber between the substrate side and the cap side;
- and
- an application specific integrated circuit at the substrate side of the MEMS device for electrically controlling the movable member between an open position breaking an electrical connection to the substrate side and a closed position completing an electrical connection to the substrate side;
- and
- a conductive flip chip connection attached externally to the cap side of the MEMS device.
2 more elements
Dependencies are inferred from the claim text.