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US 12,000,857 B2Granted
Sensor module having conductive bonding members with varying melting points and young's moduli
AssigneeSeiko Epson Corporation
InventorMasayasu Sakuma
Life of this patent
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Abstract
A sensor module includes: a substrate including a first terminal and a second terminal; a first conductive bonding member having a first melting point and a first Young's modulus; a lead bonded to the first terminal by the first conductive bonding member; a second conductive bonding member having a second melting point lower than the first melting point and a second Young's modulus higher than the first Young's modulus; and an inertial sensor bonded to the second terminal by the second conductive bonding member.
Claims7
A sensor module, comprising:
- a substrate, including a first surface and a second surface on front and back sides of each other, an external terminal provided at one of the first surface and the second surface, and an internal terminal provided at the first surface;
- a lead bonded to the external terminal and having a gull-wing shape;
- a first conductive bonding member having a first melting point and a first Young's modulus, the first conductive bonding member being interposed between the lead and the external terminal, and the first conductive bonding member bonding the lead to the external terminal;
- an inertial sensor bonded to the internal terminal, the inertial sensor including a lower surface and a coupling terminal provided at the lower surface, the coupling terminal being configured to input a control signal for controlling the inertial sensor and output a detection signal from the inertial sensor;
- a second conductive bonding member having a second melting point lower than the first melting point and a second Young's modulus higher than the first Young's modulus, the second conductive bonding member being interposed between the coupling terminal and the internal terminal, and the second conductive bonding member bonding the coupling terminal to the internal terminal so as to bond the inertial sensor to the internal terminal;
- and
- a cap bonded to the first surface of the substrate so that side walls of the cap, a top plate of the cap extending between distal ends of the side walls, and the first surface of the substrate define an enclosed housing area,
- wherein the inertial sensor, the coupling terminal, the internal terminal, and the second conductive bonding member are provided on the first surface of the substrate and disposed within the housing area so as to be housed between the cap and the first surface of the substrate, and
- wherein the external terminal, the lead, and the first conductive bonding member are disposed outside of the housing area.
6 more elements
A sensor module, comprising:
- a substrate including an external terminal and an internal terminal;
- a first conductive bonding member having a first melting point and a first Young's modulus;
- a lead bonded to the external terminal by the first conductive bonding member, the first conductive bonding member being interposed between the lead and the external terminal;
- a second conductive bonding member having a second melting point lower than the first melting point and a second Young's modulus higher than the first Young's modulus;
- an inertial sensor including a coupling terminal, the coupling terminal being bonded to the internal terminal by the second conductive bonding member, the second conductive bonding member being interposed between the coupling terminal and the internal terminal;
- and
- a cap bonded to the substrate and housing, in an enclosed housing area between the cap and the substrate, the inertial sensor, the coupling terminal, the internal terminal, and the second conductive bonding member, the housing area being an only area housed between the cap and the substrate,
- wherein the coupling terminal inputs a control signal for controlling the inertial sensor, and outputs a detection signal from the inertial sensor, and
- the external terminal, the lead, and the first conductive bonding member are disposed outside of the housing area between the cap and a first surface of the substrate.
6 more elements
Dependencies are inferred from the claim text.