B81B 2207/012
The micromechanical device and the control or processing electronics being separate parts
Official title: the micromechanical device and the control or processing electronics being separate parts in the same package
B81B2207/012 (The micromechanical device and the control or processing electronics being separate parts) appears on 767 US grants and 945 published applications in this corpus.
Search patents in B81B- Granted patents
- 767
- Published applications
- 945
- Assignees
- 251
- Inventors
- 1,456
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 1 | 1 |
| 2004 | 0 | 3 |
| 2005 | 2 | 4 |
| 2006 | 0 | 3 |
| 2007 | 2 | 5 |
| 2008 | 3 | 13 |
| 2009 | 2 | 14 |
| 2010 | 11 | 9 |
| 2011 | 8 | 13 |
| 2012 | 10 | 23 |
| 2013 | 15 | 22 |
| 2014 | 26 | 47 |
| 2015 | 27 | 43 |
| 2016 | 49 | 78 |
| 2017 | 81 | 120 |
| 2018 | 75 | 92 |
| 2019 | 95 | 73 |
| 2020 | 88 | 88 |
| 2021 | 64 | 63 |
| 2022 | 63 | 68 |
| 2023 | 47 | 47 |
| 2024 | 40 | 34 |
| 2025 | 32 | 49 |
| 2026 | 26 | 33 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Inertial measurement unit22 Sep 2026US 12,741,864 B2Seiko Epson Corporation
- Protection of sensing element during moulding15 Sep 2026US 12,736,428 B2Melexis Technologies SA
- Micro-electro-mechanical systems and preparation method thereof25 Aug 2026US 12,715,762 B2Huawei Technologies Co., Ltd.
- MEMS pressure sensor11 Aug 2026US 12,704,427 B2MEI Micro, Inc.
- Micromechanical device comprising a hydrogen drainage layer14 Jul 2026US 12,679,721 B2Robert Bosch GmbH
- Packaging method for mems acoustic device structure, mems acoustic device packaging structure and mems chip packaging method for acoustic device8 Oct 2026US 2026/0307982 A1Hefei Smat Technology Co., Ltd.
- Sound Producing Device and Sound Producing Package17 Sep 2026US 2026/0274652 A1xMEMS Labs, Inc.
- Process flow for thin contactless thermal sensors17 Sep 2026US 2026/0276451 A1STMicroelectronics International N. V.
- Integrated device package with carrier17 Sep 2026US 2026/0282981 A1Skyworks Solutions, Inc.
- Stacked die package and methods of forming the same17 Sep 2026US 2026/0283037 A1Qorvo US, Inc.
Most cited
By later US patents
- MEMS and CMOS integration with low-temperature bonding243US 9,394,161 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- CMOS-MEMS device structure, bonding mesa structure and associated method235US 9,656,852 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Bonded structures181US 10,002,844 B1Invensas Bonding Technologies, Inc. · 2018
- Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom155US 7,442,570 B2Invensence Inc. · 2008
- Reversible top/bottom MEMS package79US 8,115,283 B1Amkor Technology, Inc. · 2012