B81B 2207/99
Microstructural systems or auxiliary parts thereof not provided for in b81b2207/01 -
Official title: Microstructural systems or auxiliary parts thereof not provided for in B81B2207/01 - B81B2207/115
B81B2207/99 (Microstructural systems or auxiliary parts thereof not provided for in b81b2207/01 -) appears on 34 US grants and 40 published applications in this corpus.
Search patents in B81B- Granted patents
- 34
- Published applications
- 40
- Assignees
- 21
- Inventors
- 80
- Latest grant
- 31 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 1 | 1 |
| 2004 | 1 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 2 |
| 2012 | 1 | 0 |
| 2013 | 2 | 1 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 2 | 5 |
| 2017 | 2 | 6 |
| 2018 | 4 | 3 |
| 2019 | 3 | 3 |
| 2020 | 4 | 6 |
| 2021 | 1 | 2 |
| 2022 | 4 | 3 |
| 2023 | 2 | 2 |
| 2024 | 2 | 3 |
| 2025 | 3 | 2 |
| 2026 | 2 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Die stacking with controlled tilt and angular alignment31 Mar 2026US 12,589,990 B2STMicroelectronics International N. V.
- MEMS device, method for manufacturing MEMS device and electronic device10 Mar 2026US 12,570,519 B2Beijing BOE Technology Development Co., Ltd.
- Impact-resistant micromechanical arms16 Sep 2025US 12,415,718 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Expansion mediated adhesive device12 Aug 2025US 12,384,945 B2BVW Holding AG
- Anchor and cavity configuration for MEMS-based cooling systems20 May 2025US 12,308,302 B2Frore Systems Inc.
- Expansion mediated adhesive device21 May 2026US 2026/0139166 A1
- Impact-resistant micromechanical arms27 Nov 2025US 2025/0361139 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Monocrystalline nickel-titanium films on single crystal silicon substrates using seed layers16 Jan 2025US 2025/0019230 A1
- Die stacking with controlled tilt and angular alignment26 Dec 2024US 2024/0425364 A1NXP USA, Inc.
- Mems device, method for manufacturing mems device and electronic device8 Aug 2024US 2024/0262678 A1Beijing BOE Technology Development Co., Ltd.
Most cited
By later US patents
- Method of manufacturing semiconductor device, narrow pitch connector, electrostatic actuator, piezoelectric actuator, ink jet head, ink jet printer, micromachine, liquid crystal panel, and electronic device21US 6,573,157 B1Seiko Epson Corporation · 2003
- Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip11US 9,896,330 B2Texas Instruments Incorporated · 2018
- Directional microphone and associated packing techniques5US 10,081,537 B22018
- Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip4US 10,233,074 B2Texas Instruments Incorporated · 2019
- Waterproof microphone and associated packing techniques3US 10,562,761 B22020