MEMS device, method for manufacturing MEMS device and electronic device

An MEMS device, comprising:

• a first dielectric substrate and a first component on the first dielectric substrate;
• wherein the first component and the first dielectric substrate enclose a movable space;
• the first component has a first portion corresponding to the movable space;
• wherein the first portion has at least one first opening, and
• at least one protruding structure is on a side of the first portion close to the first dielectric substrate;
• orthographic projections of the at least one protruding structure and the at least one first opening on the first dielectric substrate do not overlap with each other;
• and
• a thickness of each protruding structure is smaller than a height of the movable space,
• wherein the first component comprises a bridge floor structure and at least one connecting arm;
• the bridge floor structure is fixed to the first dielectric substrate through the at least one connecting arm, and the bridge floor structure is used as the first portion;
• the MEMS device further comprises a driving electrode on the first dielectric substrate and an interlayer insulating layer covering the driving electrode;
• the bridge floor structure spans across the driving electrode;
• and
• there is a distance between the bridge floor structure and the interlayer insulating layer covering the driving electrode;
• and
• wherein the at least one protruding structure is on the interlayer insulating layer which is arranged on the first dielectric substrate, and is in direct contact with the interlayer insulating layer;
• and there is a distance between an end of the at least one protruding structure facing the bridge floor structure and the bridge floor structure to form a gap between the end of the at least one protruding structure and the bridge floor structure, which is within the movable space.