B81B 2207/03
Electronic circuits for micromechanical devices which are not application specific
Official title: Electronic circuits for micromechanical devices which are not application specific, e.g. for controlling, power supplying, testing, protecting
B81B2207/03 (Electronic circuits for micromechanical devices which are not application specific) appears on 111 US grants and 149 published applications in this corpus.
Search patents in B81B- Granted patents
- 111
- Published applications
- 149
- Assignees
- 71
- Inventors
- 336
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2011 | 0 | 2 |
| 2012 | 0 | 0 |
| 2013 | 1 | 4 |
| 2014 | 2 | 7 |
| 2015 | 7 | 7 |
| 2016 | 4 | 3 |
| 2017 | 4 | 2 |
| 2018 | 6 | 10 |
| 2019 | 6 | 18 |
| 2020 | 10 | 7 |
| 2021 | 12 | 14 |
| 2022 | 13 | 18 |
| 2023 | 12 | 15 |
| 2024 | 13 | 17 |
| 2025 | 12 | 9 |
| 2026 | 9 | 16 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- MEMS actuator, MEMS actuator drive method, and MEMS actuator control program4 Aug 2026US 12,699,262 B2Hamamatsu Photonics K.K.
- Micro electro-mechanical system sensor9 Jun 2026US 12,649,651 B2Samsung Electronics Co., Ltd.
- Microelectromechanical sensor device with improved management of a power-down condition12 May 2026US 12,624,966 B2STMicroelectronics International N. V.
- MEMS device with movable electrode plate and feedback capacitor21 Apr 2026US 12,606,432 B2Zhunmao (Hangzhou) Technology Co.
- MEMS microphone7 Apr 2026US 12,598,430 B2Soundskrit Inc.
- Electronic devices and methods of manufacturing electronic devices1 Oct 2026US 2026/0296878 A1Amkor Technology Singapore Holding Pte. Ltd.
- Micro-electro-mechanical system package17 Sep 2026US 2026/0274649 A1Vanguard International Semiconductor Corporation
- Ultrasonic transceiver with stacked die back cavity10 Sep 2026US 2026/0265045 A1
- Asic capped double layer mems platform20 Aug 2026US 2026/0242213 A1Murata Manufacturing Co., Ltd.
- Microelectromechanical sensor device with improved management of a power-down state20 Aug 2026US 2026/0243582 A1STMicroelectronics International N. V.
Most cited
By later US patents
- Chip-scale LIDAR with a single MEMS scanner in a compact optical package13US 10,564,263 B2GM Global Technology Operations LLC · 2020
- MEMS component and mobile device comprising the MEMS component12US 10,715,926 B2Infineon Technologies AG · 2020
- Calibration and alignment of coherent lidar system6US 10,914,821 B2GM Global Technology Operations LLC · 2021
- Compensation of changes in MEMS capacitive transduction6US 9,000,833 B2Silicon Laboratories Inc. · 2015
- Dual-laser chip-scale lidar for simultaneous range-doppler sensing5US 10,914,822 B2GM Global Technology Operations LLC · 2021